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Manufacturer Part #
BM71BLES1FC2-0B02AA
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171 per Tray
Surface Mount
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Product Category: Bluetooth Module, Bluetooth SiliconDescription of Change: Qualification of MTAI as an additional assembly site for selected BM64, RN4678, BM83, BM23, BM71, BM78, RN4870, BM62, RN4871, BM20, BM70 and BM62SPKS1MC2 device families available in various module packages.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying MTAI as an additional final test site.Estimated First Ship Date: 31 October 2026 (date code: 2644)
Product Category: Bluetooth Module, Bluetooth Silicon, Wireless ModulesDescription of Change: Qualification of MTAI as an additional final test site for selected ATZBRF233, BM78, BM23, RN4871, BM71, BM83, BM20, RN4678, BM62SPKS1MC2, BM62, BM64, RN4870 and BM70 device families available in various packages.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability and on-time delivery performance by qualifying MTAI as an additional final test site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: October 2026
Microchip has released a new Datasheet for the BM70/BM71 Bluetooth Low Energy (LE) Module Data Sheet of devices.Description of Change:Physical Dimensions: Updated Figure 6-1, Figure 6-3, Figure 6-5 and Figure 6-7 with tolerance information.
***FPCN109722 UPDATE***Revision History:December 17, 2024: Issued initial notification.January 24, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on February 24, 2025.Description of Change:Qualification of MTAI as an additional final test site for selected BM70, BM71, RN4870, RN4871 device families available in 16L (11.5x9x2.1 mm), 33L (12x22mm), 30L (12x15mm) and 17L (8x6x1.6 mm) Module packages.
Description of Change:Qualification of MTAI as an additional final test site for selected BM70, BM71,RN4870, RN4871 device families available in 16L (11.5x9x2.1 mm), 33L (12x22mm), 30L (12x15mm)and 17L (8x6x1.6 mm) Module packages.Reason for Change: To improve on-time delivery performance by qualifying MTAI as an additional finaltest site.V
Description of Change:Microchip has released a new Datasheet for the BM70/71 Bluetooth Low Energy Module of devices.Reason for Change: To Improve Productivity
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.