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Manufacturer Part #
MCP2515-I/ST
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74 per Tube
TSSOP-20
Surface Mount
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*** Update of FPCN 118923 ***Revision History: February 02, 2026: Issued initial notification.June 30, 2026: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on November 30, 2026. Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material, MC27 as a new mold compound material, and EP27 as a new die attach material for MCP2515T-I/STRB4, MCP2515T-E/STRB2, MCP2515-I/STRB2, MCP2515-E/STRB4, MCP2515TE/ST, MCP2515-E/ST, MCP2515-E/STRB2, MCP2515T-I/STRB2, MCP2515T-I/ST, MCP2515I/STRB4, MCP2515T-E/STRB4, MCP2515-I/ST, MCP2515-E/STVAO, MCP2515T-E/STVAO, MCP2515-I/STVAO, and MCP2515T-I/STVAO catalog part numbers (CPN) available in 20L TSSOP (4.4mm) packages at ANAP assembly site.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material, MC27 as a new mold compound material, and EP27 as a new die attach material standardize the use of PFAS free material at ANAP assembly site.Estimated First Ship Date: 30 November 2026 (date code: 2649)
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 558-2C31 as a new die attach material for MCP2515-E/ST, MCP2515-E/STRB2, MCP2515-E/STRB4, MCP2515-I/ST, MCP2515-I/STRB2, MCP2515-I/STRB4, MCP2515T-E/ST, MCP2515T-E/STRB2, MCP2515T-E/STRB4, MCP2515T-I/ST, MCP2515T-I/STRB2 and MCP2515T-I/STRB4 catalog part numbers (CPN) available in 20L TSSOP (4.4mm) package at NSEB assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 558-2C31 as a new die attach materialEstimated Qualification Completion Date: July 2026
Product Category: CAN ControllerDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material, MC27 as a new mold compound material, and EP27 as a new die attach material for MCP2515T-I/STRB4, MCP2515T-E/STRB2, MCP2515-I/STRB2, MCP2515E/STRB4, MCP2515T E/ST, MCP2515-E/ST, MCP2515-E/STRB2, MCP2515T-I/STRB2, MCP2515T-I/ST, MCP2515-I/STRB4, MCP2515T-E/STRB4, MCP2515-I/ST, MCP2515-E/STVAO, MCP2515T-E/STVAO, MCP2515-I/STVAO, and MCP2515T-I/STVAOcatalog part numbers (CPN) available in 20L TSSOP (4.4mm) packages at ANAP assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material, MC27 as a new mold compound material, and EP27 as a new die attach material standardize the use of PFAS free material at ANAP assembly site.Estimated Qualification Completion Date: October 2026
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
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Microchip Technology Inc. is a leading provider of microcontroller and analog semiconductors, providing low-risk product development, lower total system cost and faster time to market for thousands of diverse customer applications worldwide. Microchip’s product line is the solution for your embedded design needs. From cost-competitive Analog and Memory devices to performance PIC® Microcontrollers (MCUs) and dsPIC® Digital Signal Controllers (DSCs), their devices provide a custom fit in your cost sensitive design. Quickly integrate their devices into applications from simple to complex. Their starter kits and free reference designs can help get you going.
CAN (control-area network) is a broadcast serial bus standard for connecting nodes.Each node is able to send and receive messages, but not simultaneously.: a message is transmitted serially onto the bus, one bit after another.The devices that are connected by a CAN network are typically sensors, actuators and control devices.
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