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Manufacturer Part #
CPC7695BCTR
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1000 per Reel
SOIC-28
Surface Mount
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Description:Littelfuse IXYS Integrated Circuits Division?s (ICD) would like to notify you about the Sputter change for selected ICD products. Wafer manufacturing process involves sputtering metal on the surface of the wafer so the end product will perform the necessary electrical functions. In the process of sputtering metal, a ?target? is used which is a consumable item. Previously used metal target has been discontinued and new metal target with a composition change from 2% Cu to 0.5% Cu has been qualified. Both targets have been in production for many years on similar technology platforms.
IXYS Integrated Circuits Division (ICD), now part of Littelfuse, would like to notify you that we will transfer and consolidate the assembly and test process of the below products to another already approved facility:
Part Status:
On Order
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
