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Manufacturer Part #
MIC2545A-1YM
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95 per Tube
SOIC-8
Surface Mount
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Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material, G700LTD as a new mold compound material and 8303A as a new die attach material for selected MIC2012, MIC2025, MIC2026, MIC2042, MIC2043, MIC2075, MIC2076, MIC2172, MIC2536, MIC2544, MIC2544A, MIC2545A, MIC2548, MIC2548A, MIC2549A, MIC2582, MIC2587, MIC29201, MIC29204, MIC2951, MIC2954, MIC3172, MIC3203, MIC38C42, MIC38C43, MIC38C44, MIC38C45, MIC38HC42, MIC38HC43, MIC38HC44, MIC38HC45, MIC4223, MIC4224, MIC4225, MIC4801, MIC5014, MIC5015, MIC5020, MIC5021, MIC5156, MIC5200, MIC5201 and MIC5202 device families available in 8L SOIC (.150in) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material, G700LTD as a new mold compound material and 8303A as a new die attach material.
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Part Status:
The MIC2545A-1YM is a part of MIC2545A 5.5 V integrated high-side power switches optimized for low loss DC power switching and other power management applications, including Advanced Configuration and Power Interface (ACPI)
The MIC2545A/49A is a cost-effective, highly integrated solution that requires few external components to satisfy USB and ACPI requirements. Load current management features include a precision,resistor-programmable output current-limit and a soft-start circuit, which minimizes inrush current when the switch is enabled
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.