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Manufacturer Part #
ISC019N04NM5ATMA1
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5000 per Reel
TDSON-8 FL
Surface Mount
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Subject : Change of gate wire material to copper wire for dedicated OptiMOS? products in PG-TDSON-8 packageDescription :Old Wire bond material Gold (Au)New Wire bond material Copper (Cu) Reason: Copper wire bonding is part of Infineon?s continuous drive to deliver higher performance products. A copper wire enables superior electrical, thermal and reliability performance compared to gold, making it an excellent interconnect solution for industrial packagingIntended start of delivery 2026-10-30 or earlier, depending on customer approval
Detailed change informationSubject: Capacity extension for dedicated OptiMOS?5 40V and OptiMOS?6 40V and 80V products in PG-TDSON-8 package at Infineon Technologies Wuxi Co., Ltd., China.Description Old- Infineon Technologies Malaysia Sdn. Bhd.,MelakaNew- Infineon Technologies Malaysia Sdn. Bhd., Melaka- Infineon Technologies Wuxi Co., Ltd., ChinaReason:Extension of high-volume assembly manufacturing capability to cover increasing customer demand and support short term upside demand in a more efficient way.Intended start of delivery 2025-08-01 or earlier based on customer approval
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.