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Manufacturer Part #
PIC16C505-04I/SL
Download the CAD models for this product. Learn more about SnapMagic.
57 per Tube
SOIC-14
Surface Mount
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
HTS Code:
ECCN:
PCN Information:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 120K and 121K wafer technologies available in 14L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxy or Gold wire and 8390A die attach epoxy.Reason for Change: To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Microchip provides solutions for the entire performance range of 8-bit, 16-bit, and 32-bit microcontrollers.The 8-bit PIC® microcontroller solutions feature a powerful architecture, flexible memory technologies, comprehensive easy-to-use development tools, comprehensive application notes, complete technical documentation and post design-in support through a worldwide sales and distribution network. Microchip is committed to easy migration across product families, providing seamless program memory expansion, pin compatibility, and a unified development environment for all products.
This powerful (200 nanosecond instruction execution) yet easy-to-program (only 33 single word instructions) CMOS ROM-based 8-bit microcontroller packs Microchip’s powerful PIC® architecture into a 14-pin package. Easily adapted for applications ranging from personal care appliances and security systems to low power remote transmitters/receivers.
PIC16C505-04I/SL is part of the PIC16C5XX Series family with a 8-Bit Microcontroller.It can sustain standard temperature ranges from -40°C to +125°C and has 14 pin in SOIC package. This device is lead free.
Features:
On Order
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.