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Manufacturer Part #
CY14B101LA-SP25XIT
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1000 per Reel
SSOP-48
Surface Mount
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Description:Old:Al BEOL:Aluminum (Al) Backend of Line (BEOL):- Metallization 3 Al metal layers- Tungsten (W) plugs and Ti/TiN/Al metallizationLabel without HAL-free and/or PB-freeNew:Al BEOL:Aluminum (Al) Backend of Line (BEOL):- Metallization 3 Al metal layers- Tungsten (W) plugs and Ti/TiN/Al metallizationCu BEOL:Copper (Cu) Backend of Line (BEOL): - Metallization - 3 Cu metal layers + 1 bond pad Al metal layer- Cu plugs and Cu damascenewith Ta/TaN barriers Label with HAL-free and/or PB-freeReason;Due to continuously rising demand for Infineon products, we additionally enable the BackEnd of Line (BEOL) copper manufacturing process for flexible manufacturing to increase capacity at Skywater Fab25.Copper backend metallization is completely compatible with existing product from a form, fit, functional, parametric, and quality performance perspectives. Standardization of labelling for Infineon products.Deeper integration of supply chain and detailed assessment confirmed HAL-free and/or PB-free products in Infineon portfolio. Last order date: 2026-08-18Last delivery date: 2026-11-18
Description:Change of mold compound / encapsulation materialReason:To ensure delivery capability by establishing alternative assembly and packaging mold material supplier to assure continuity of supply.
Detailed change informationSubject Label change affecting dedicated Legacy Cypress products.Reason Change of label size (with no impact on bar code) to align Legacy Cypress with IFX label size.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.