Manufacturer Part #
MCP42010-I/SL
DIGITAL POT, 256 STEPS, SPI, 10KOHMS, DUAL CHANNEL
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:57 per Tube Package Style:SOIC-14 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2416 | ||||||||||
Microchip MCP42010-I/SL - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 120K and 121K wafer technologies available in 14L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxy or Gold wire and 8390A die attach epoxy.Reason for Change: To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Microchip MCP42010-I/SL - Technical Attributes
| No of Positions: | 256 |
| No of Channels: | 2 |
| Interface: | SPI |
| Wiper Storage: | Volatile |
| Resistance: | 10kΩ |
| Tolerance: | ±20% |
| Supply Voltage: | 2.7V to 5.5V |
| Supply Current: | 500µA |
| Operating Temp Range: | -40°C to +85°C |
| Resolution: | 8b |
| Wiper Resistance: | 125Ω |
| Package Style: | SOIC-14 |
| Mounting Method: | Surface Mount |
Features & Applications
The MCP42010 series of digital potentiometer features two independent channels, 8-bit resolution (256 wiper steps), and an industry-standard SPI serial interface.
The wiper position varies linearly and is controlled via the SPI interface. The MCP42010 has a resistance value of 10 kohm, outstanding AC and DC characteristics, and consumes <1 µA during static operation. The MCP42010 is available in 14-pin PDIP, SOIC and TSSOP packages.
Features:
- 256 taps for each potentiometer
- Potentiometer values for 10 kΩ, 50 kΩ and 100 kΩ
- Single and dual versions
- SPI™ serial interface (mode 0,0 and 1,1)
- ±1 LSB max INL & DNL
- Low power CMOS technology
- 1 μA maximum supply current in static operation
- Multiple devices can be daisy-chained together (MCP42XXX only)
- Shutdown feature open circuits of all resistors for maximum power savings
- Hardware shutdown pin available on MCP42XX only
- Single supply operation (2.7 V - 5.5 V)
- Industrial temperature range: -40°C to +85°C
- Extended temperature range: -40°C to +125°C
Applications:
- Audio equipment (volume and tone controls)
- Servo-motor control, battery charging and control
- Communications (line impedance matching)
- Power supplies, instrumentation (gain, offset adjust)
- LCD contrast control and programmable filters
Available Packaging
Package Qty:
57 per Tube
Package Style:
SOIC-14
Mounting Method:
Surface Mount