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Manufacturer Part #
BM78SPPS5MC2-0002AA
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88 per Tray
Surface Mount
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PCN Information:
Product Category: Bluetooth Module, Bluetooth SiliconDescription of Change: Qualification of MTAI as an additional assembly site for selected BM64, RN4678, BM83, BM23, BM71, BM78, RN4870, BM62, RN4871, BM20, BM70 and BM62SPKS1MC2 device families available in various module packages.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying MTAI as an additional final test site.Estimated First Ship Date: 31 October 2026 (date code: 2644)
Product Category: Bluetooth Module, Bluetooth Silicon, Wireless ModulesDescription of Change: Qualification of MTAI as an additional final test site for selected ATZBRF233, BM78, BM23, RN4871, BM71, BM83, BM20, RN4678, BM62SPKS1MC2, BM62, BM64, RN4870 and BM70 device families available in various packages.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability and on-time delivery performance by qualifying MTAI as an additional final test site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: October 2026
Product Category: Bluetooth ModuleNotification Subject: CCB 8270 Final Notice: Qualification of U08D as a new fabrication location for Die #2 under catalog part numbers AT24C64D-XHM-T and 24AA64T-I/ST available in 8L TSSOP (4.4mm) used in the U4 component of selected RN4678, RN4678RN4678APL, BM78SPPS5MC2 and BM78SPP05MC2 device families available in 30L and 33L MODULE (12x15mm and 12x22mm) packages.Description of Change: Qualification of U08D as a new fabrication location for Die #2 under catalog part numbers AT24C64D-XHM-T and 24AA64T-I/ST available in 8L TSSOP (4.4mm) used in the U4 component of selected RN4678, RN4678RN4678APL, BM78SPPS5MC2 and BM78SPP05MC2 device families available in 30L and 33L MODULE (12x15mm and 12x22mm) packages.Pre and Post Summary Changes: See attched SPCN document for more detailsReason for Change: To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at United Microelectronics Corporation (Fab 8D) (U08D) site for Die #2 used in the component U4.Estimated First Ship Date: 17 July 2026 (date code: 2629)
Notification Subject: Data Sheet - BM78-Bluetooth Dual Mode ModuleDescription of Change:Microchip has released a new Datasheet for the BM78-Bluetooth Dual Mode Module of devices.Note: See attached SPCN document for more detailed descriptionReason for Change: To Improve ProductivityDate Document Changes Effective: 2 Jun 2026
Product Category: Bluetooth ModuleDescription of Change: Implement top marking change for BM78SPPS5NC2-0002AA, BM78SPPS5NC2-0001AA, BM78SPPS5MC2-0004AA, BM78SPPS5MC2-0002AA, BM78SPPS5MC2-0001AA, BM78SPPS5MC2-0B01AA, BM78SPPS5MC2-0B06AA, BM78SPPS5MC2-0006AA, BM78SPPS5MC2-0B04AA and BM78SPPS5MC2-0B02AA catalog part numbers (CPN) available in 33L MODULE (12x22mm) package.Reason for Change: To improve productivity by implementing top marking changes.Estimated First Ship Date: 15 July 2026 (date code: 2629)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
