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AT25M01-SSHM-B
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100 per Tube
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*** Update of FPCN 124320 ***Revision History: September 15, 2026: Issued initial notification.September 25, 2026: Re-issued initial notification to remove wire sweep test from the Qual Plan.Product Category: MemoryDescription of Change: Qualification of CRM-1064L as an additional die attach material and G630AY as an additional mold compound for selected 24AA1025, 24AA1026, 24AA128, 24AA256, 24AA32A, 24AA32AF, 24AA512, 24AA64, 24AA64F, 24CS128, 24CS256, 24CS32, 24CS512, 24CS64, 24CSM01, 24CW1280, 24CW160, 24CW320, 24CW640, 24FC1025, 24FC1026, 24FC128, 24FC256, 24FC512, 24FC64, 24FC64F, 24LC1025, 24LC1026, 24LC128, 24LC256, 24LC32A, 24LC32AF, 24LC512, 24LC64, 24LC64F, 25CSM01, AT24C128C, AT24C256C, AT24C32D, AT24C32E, AT24C512C, AT24C64B, AT24C64D, AT24CM01 and AT25M01 device families available in 8L SOIC (.150in) package at MTAI assembly site.Pre and Post Summary Changes:See attached SPCN for more detailsReason for Change: To improve manufacturability by qualifying CRM-1064L as an additional die attach material and G630AY as an additional mold compound at MTAI assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: September 2026
Product Category: MemoryDescription of Change: Qualification of CRM-1064L as an additional die attach material and G630AY as an additional mold compound for selected 24AA1025, 24AA1026, 24AA128, 24AA256, 24AA32A, 24AA32AF, 24AA512, 24AA64, 24AA64F, 24CS128, 24CS256, 24CS32, 24CS512, 24CS64, 24CSM01, 24CW1280, 24CW160, 24CW320, 24CW640, 24FC1025, 24FC1026, 24FC128, 24FC256, 24FC512, 24FC64, 24FC64F, 24LC1025, 24LC1026, 24LC128, 24LC256, 24LC32A, 24LC32AF, 24LC512, 24LC64, 24LC64F, 25CSM01, AT24C128C, AT24C256C, AT24C32D, AT24C32E, AT24C512C, AT24C64B, AT24C64D, AT24CM01 and AT25M01 device families available in 8L SOIC (.150in) package at MTAI assembly site.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability by qualifying CRM-1064L as an additional die attach material and G630AY as an additional mold compound at MTAI assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: September 2026
Product Category: MemoryNotification Subject: CCB 8400 Initial Notice: Qualification of MMT as an additional assembly site for selected 24AA102x, 24AA128, 24AA256, 24AA32A, 24AA32AF, 24AA512, 24AA64, 24AA64F, 24CS128, 24CS256, 24CS32, 24CS512, 24CS64, 24CSM01, 24CW1280, 24CW160, 24CW320, 24CW640, 24FC102x, 24FC128, 24FC256, 24FC512, 24FC64, 24FC64F, 24LC102x, 24LC128, 24LC256, 24LC32A, 24LC32AF, 24LC512, 24LC64, 24LC64F, 25CSM01, AT24C128C, AT24C256C, AT24C32x, AT24C512C, AT24C64x, AT24CM01 and AT25M01 device families available in 8L SOIC (3.90mm) packageDescription of Change: Qualification of MMT as an additional assembly site for selected 24AA102x, 24AA128, 24AA256, 24AA32A, 24AA32AF, 24AA512, 24AA64, 24AA64F, 24CS128, 24CS256, 24CS32, 24CS512, 24CS64, 24CSM01, 24CW1280, 24CW160, 24CW320, 24CW640, 24FC102x, 24FC128, 24FC256, 24FC512, 24FC64, 24FC64F, 24LC102x, 24LC128, 24LC256, 24LC32A, 24LC32AF, 24LC512, 24LC64, 24LC64F, 25CSM01, AT24C128C, AT24C256C, AT24C32x, AT24C512C, AT24C64x, AT24CM01 and AT25M01 device families available in 8L SOIC (3.90mm) package.Pre and Post Summary Changes:Pre ChangeMicrochip Technology Thailand (HQ)(MTAI)Post ChangeMicrochip Technology Thailand (HQ)(MTAI)Note: See attached SPCN document for more detailed descriptionReason for Change: To improve on-time delivery performance by qualifying MMT as an additional assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: September 2026
Product Category: MemoryNotification Subject: CCB 7235.002 and 6183.009 Final Notice: Qualification of MTAI as an additional assembly and final test site for AT25M01-SSHM-T and AT25M01-SSHM-B catalog part numbers (CPN) available in 8L SOIC (.150in) package.Description of Change: Qualification of MTAI as an additional assembly and final test site for AT25M01-SSHM-T and AT25M01-SSHM-B catalog part numbers (CPN) available in 8L SOIC (.150in) package.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve productivity and on-time delivery performance by qualifying MTAI as an additional assembly and final test siteEstimated First Ship Date: 30 July 2026 (date code: 2631)
Description of Change:Qualification of U08D as an additional fabrication site using 66.91K process technology for selected products of AT25M01, 25LC1024 and 25AA1024 device families available in 8L SOIC (.150in) , SOIJ (.208in), PDIP (.300in) and DFN-S (6x5x0.9mm) packages.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying U08D as an additional fabrication site using 66.91K process technology.
*** Update for FPCN 116561 ***Revision History: October 07, 2025: Issued final notification.March 11, 2026: Re-issued final notification. Updated the the Pre and Post Change Summary to add Lead Plating change and attached the PFAS Elimination and Die Attach Explanation.Description of Change: Qualification of AMK-EP27 as an additional die attach material, AMK-MC27 as an additional molding compound material and CuPdAu as an additional wire material for AT25M01-SSHM-T and AT25M01-SSHM-B catalog part numbers (CPN) available in 8L SOIC (.150in) package.Reason for Change: To improve manufacturability by qualifying 66.9k wafer technology with AMK-EP27 as a new die attach material and CuPdAu as a new wire material.Estimated First Ship Date: 24 December 2025 (date code: 2552)
Description of Change: Qualification of AMK-EP27 as an additional die attach material, AMK-MC27 as an additional molding compound material and CuPdAu as an additional wire material for AT25M01-SSHM-T and AT25M01-SSHM-B catalog part numbers (CPN) available in 8L SOIC (.150in) package.Reason for Change: To improve manufacturability by qualifying 66.9k wafer technology with AMK EP27 as a new die attach material and CuPdAu as a new wire material.Estimated First Ship Date: 24 December 2025 (date code: 2552)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change:Qualification of 95x155 mils leadframe paddle size for selected AT25512 and AT25M01 device families available in 8L SOIC (3.90mm) package at ANAP assembly site.Reason for Change:To improve manufacturability by qualifying 95x155 mils leadframe paddle size at ANAP assembly site.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
