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MCP6024T-I/SL
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2600 per Reel
SOIC-14
Surface Mount
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*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Microchip has released a new Datasheet for the MCP6021/1R/2/3/4 - Rail-to-Rail Input/Output, 10 MHz Op Amps of devices. Notification Status: FinalDescription of Change: ? Added Section ?Product Identification System (Automotive)?.? Updated 6.0 ?Packaging Information?Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 12 Apr 2023
Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 120K and 121K wafer technologies available in 14L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxy or Gold wire and 8390A die attach epoxy.Reason for Change: To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
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The MCP6024 series of quad operational amplifier (op amp) has a gain bandwidth product of 10 MHz with a low typical operating current of 1.0 mA and an offset voltage that is less than 0.5 mV. The MCP6024 uses Microchip's advanced CMOS technology, which provides low bias current, high-speed operation, high open-loop gain and rail-to-rail output swing.
The MCP6024 operates with a single supply voltage that can be as low as 2.5 V, while drawing less than 1.35 mA of quiescent current per amplifier. The MCP6024 is available in standard 14-lead PDIP, SOIC and TSSOP packages. This amplifier is ideal for battery and loop-powered applications as well as industrial process control, low-power battery-operated devices, portable equipment, data acquisition equipment, test equipment and low-end audio applications.
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.