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TC1412NCOA
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100 per Tube
SOIC-8
Surface Mount
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*** Update for PCN 115157 ***Revision History: August 12, 2025: Issued initial notification. November 25, 2025: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on December 15, 2025. Added column "Change (Yes/No)" in the pre and post change tableDescription of Change: Qualification of CRM-1151GA as new die attach material for selected MCP1404, MCP1406, MCP1407, MCP14E4, TC1410, TC1410N, TC1411, TC1411N, TC1412, TC1412N, TC1413, TC1413N, TC429, TC4420, TC4421A, TC4422A, TC4423A, TC4424A, TC4426A, TC4427, TC4427A, TC4429, TC4431, TC4432, TC4451 and TC4452 device families available in 8L SOIC (3.90mm) package at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated First Ship Date: 15 December 2025 (date code: 2551)
*** Update for PCN 115290 ***Revision History: August 13, 2025: Issued initial notification.November 13, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 24, 2025.Description of Change: Qualification of CRM-1151GA as new die attach material for selected MCP1403, MCP1404, MCP1405, MCP1406, MCP1407, MCP14E3, MCP14E4, MCP14E5, TC1410, TC1410N, TC1411, TC1411N, TC1412, TC1412N, TC1413, TC1413N, TC1426, TC1427, TC1428, TC426, TC427, TC428, TC429, TC4420, TC4421A, TC4422A, TC4423A, TC4424A, TC4425A, TC4426, TC4426A, TC4427, TC4427A, TC4428, TC4428A, TC4429, TC4431, TC4432, TC4451 and TC4452 available in 8L SOIC (3.90mm) package at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated First Ship Date: 24 December 2025 (date code: 2552)
*** Update for PCN 110961 ***Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2(TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO ? Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 30 September 2025 (date code: 2540)Revision History: February 19, 2025: Issued initial notification.September 04, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 30, 2025.
Description of Change: Qualification of CRM-1151GA as new die attach material for selected MCP1403, MCP1404, MCP1405, MCP1406, MCP1407, MCP14E3, MCP14E4, MCP14E5, TC1410, TC1410N, TC1411, TC1411N, TC1412, TC1412N, TC1413, TC1413N, TC1426, TC1427, TC1428, TC426, TC427, TC428, TC429, TC4420, TC4421A, TC4422A, TC4423A, TC4424A, TC4425A, TC4426, TC4426A, TC4427, TC4427A, TC4428, TC4428A, TC4429, TC4431, TC4432, TC4451 and TC4452 available in 8L SOIC (3.90mm) package at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated Qualification Completion Date: September 2025
Description of Change: Qualification of CRM-1151GA as new die attach material for selected MCP1404, MCP1406, MCP1407, MCP14E4, TC1410, TC1410N, TC1411, TC1411N, TC1412, TC1412N, TC1413, TC1413N, TC429, TC4420, TC4421A, TC4422A, TC4423A, TC4424A, TC4426A, TC4427, TC4427A, TC4429, TC4431, TC4432, TC4451 and TC4452 device families available in 8L SOIC (3.90mm) package at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO ? Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: July 2025Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2(TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Cancellation NotificationDescription of Change:This qualification was originally performed to qualify new lead frame design for selected products available in 8L SOIC package using 8900NC die attach and gold (Au) bond wire material assembled at MMT assembly site.
Data Sheet - TC1412/1412N Data Sheet Silicon Die Revision AdditionDescription of Change: 1) Addition of silicon die revision A1. 2) Updated the values for Electrostatic Discharge (ESD) in the Features and General Description columns. 3) Updated the Pin Description table in Section 3.0, Pin Descriptions. 4) Updated package marking information and drawings in Section 5.0, Packaging Information. 5) Minor grammatical and spelling correcttions.Impacts to Data Sheet: Revise the features and description sections on page one ESD protect from 4kV to 2kV.
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
