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Manufacturer Part #
TC4422VPA
TC4422 Series 18 V 9 A Through Hole High-Speed Mosfet Driver - PDIP-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: |
Product Variant Information section
Available PackagingPackage Qty:60 per Tube Package Style:PDIP-8 Mounting Method:Through Hole |
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Microchip TC4422VPA - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
*** Update for PCN 110961 ***Description of Change: Qualification of Microchip Technology Colorado – Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Pre and Post Summary Changes:• Pre Change: Fabrication Site = Microchip Technology Tempe – Fab 2(TMGR), Wafer Size = 8"• Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO – Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe – Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 30 September 2025 (date code: 2540)Revision History: February 19, 2025: Issued initial notification.September 04, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 30, 2025.
Description of Change: Qualification of Microchip Technology Colorado – Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO – Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe – Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: July 2025Pre and Post Summary Changes:• Pre Change: Fabrication Site = Microchip Technology Tempe – Fab 2(TMGR), Wafer Size = 8"• Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Part Status:
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=TC4422VPA&field4=Microchip&field18=https://p1na.futureelectronics.com/p/analog--drivers--mosfet-igbt-drivers/tc4422vpa-microchip-9077069
Microchip TC4422VPA - Technical Attributes
| Configuration: | Low Side |
| No of Outputs: | Single |
| Output Current: | 2A |
| Output Impedance: | 1.4Ω |
| Peak Output Current: | 9A |
| Supply Voltage-Max: | 18V |
| Package Style: | PDIP-8 |
| Mounting Method: | Through Hole |
Available Packaging
Package Qty:
60 per Tube
Package Style:
PDIP-8
Mounting Method:
Through Hole