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Manufacturer Part #
IKCM10H60GAXKMA1
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14 per Tube
MDIP-24
Through Hole
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Subject:Extension of shelf lifetime from 3 to 5 years for certain SMD (surface mount devices), THD (through hole devices) and IPM (intelligent power modules) products. Description:Old3 yearsNew 5 years Reason:Extension of shelf lifetime and product availability.
Subject: Introduction of an additional wafer production location at Infineon Technologies Dresden GmbH, Dresden, Germany and change of wafer size from 200mm to 300mm for IGBT3 600V. Description Old :Production Site - Infineon Technologies (Kulim) Sdn. Bhd., Kulim, Malaysia New:- Infineon Technologies (Kulim) Sdn. Bhd., Kulim, Malaysia and - Infineon Technologies Dresden GmbH & Co. KG, Dresden, Germany Wafer diameter - 200mm - 200mm and 300mm Reason: Expansion of wafer production to assure continuity of supply and enable flexible manufacturing.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.