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Manufacturer Part #
MIC37101-1.5YM
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95 per Tube
SOIC-8
Surface Mount
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PCN Information:
UPDATE TO PCN 110887.Revision History: February 14, 2025: Issued initial notification.September 10, 2025: Issued final notification. Updated scope to remove MIC5200, MIC5201, MIC5202 device families and MIC5841YV-TR catalog part number and add 835-5043, LP2951, MIC2172, MIC2915x, MIC2920x, MIC2930xx, MIC2931x, MIC29371, MIC2941A, MIC29502, MIC2951, MIC2951x, MIC2954, MIC297xx, MIC2981, MIC3172, MIC37252, MIC37303, MIC3750x, MIC38C43, MIC38HC4x, MIC3915x, MIC3930x, MIC3950x, MIC3975, MIC457x, MIC501x, MIC502x, MIC5060, MIC515x, MIC580x and MIC58Pxx device families. Attached Qualification Report. Provided estimated first ship date to be on October 31, 2025.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: September 2025Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2 (TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Revision History:March 31, 2023: Issued initial notification.August 30, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 30, 2023.Description of Change:Qualification of 2200D as a new die attach material for selected MIC371xx, MIC391xx, MIC468xx and MIC469xx device families available in 8L SOIC (3.9mm) package.Reason for Change:To improve manufacturability by qualifying 2200D as a new Die Attach material.
PCN Status:Initial NotificationDescription of Change:Qualification of 2200D as a new die attach material for selected MIC371xx, MIC391xx, MIC468xx and MIC469xx device families available in 8L SOIC (3.9mm) package.Reason for Change:To improve manufacturability by qualifying 2200D as a new Die Attach material.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2023
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
