Shipping Country
Free shipping within the continental US over $50. Conditions apply
Select Country
Manufacturer Part #
MTCH6102-I/MV
Download the CAD models for this product. Learn more about SnapMagic.
91 per Tube
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Product Category: 8-Bit Microcontrollers, Capacitive Touch SensorsDescription of Change: Qualification of Panel Level Package (PLP) packaging process technology for selected PIC18F45xx, PIC16F15xx, PIC16F19xx, PIC16F72xx, PIC16LF1xx, PIC16F17xx, PIC18F46xx, PIC18F44xx, PIC18F43xx, PIC16F18xx, PIC18F47xx, PIC18F24xx, PIC18F23xx, PIC18F26xx, PIC18F25xx, MTCH6102xx, PIC16F14xx, PIC16F16xx and MTCH108xx device families available in 40L UQFN (5x5x0.5mm), 28L UQFN (4x4x0.55mm), 16L UQFN (3x3x0.5mm), 20L UQFN (4x4x0.5mm), 16L UQFN (4x4x0.5mm) and 40L UPQFN (5x5x0.5mm) packages at MP3Aassembly site.Reason for Change: To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at MP3A assembly siteEstimated Qualification Completion Date: September 2026
Description:Qualification of MPHL as an additional final test site for selected MTCH6102, PIC16F151x, PIC16F1525x, PIC16F1535x, PIC16F1715x, PIC16F171x, PIC16F1782, PIC16F1805x, PIC16F1815x, PIC16F1845x, PIC16F1885x, PIC16F193x, PIC16LF1518, PIC16LF190x, PIC18F24K4x, PIC18F24Qxx, PIC18F25K4x, PIC18F25Qxx, PIC18F26K40, PIC18F26Qxx and PIC18F27Qxx device families available in 28L UQFN (4x4x0.55mm) and VQFN (4x4x1.0mm) packages.Reason for Change: To improve manufacturability by qualifying MPHL as an additional final test site.Revision History: June 19, 2025: Issued final notification.
Description of Change: This qualification was initially performed to qualify Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change: Microchip has decided to not qualify Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Revision History: March 13, 2024: Issued initial notification.March 20, 2024: Re-issued initial notification to update qualification plan.December 17, 2024: Issued final notification. Attached the Qualification Report. Revised the affected parts list to add PIC18F46K22-E/MVC01 and PIC18F46K22T-E/MVC01 catalog part numbers. Updated post change mold compound material to NEPL Proprietary. Provided estimated first ship date to be on January 15, 2025.February 11, 2025: Re-issued final notification to include the Lead-frame package at MMT in the post change summary table. March 12, 2025: Issued cancellation notification.
PCN Status:Final NotificationDescription of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Description of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
Revision History:March 13, 2024: Issued initial notification.March 20, 2024: Re-issued initial notification to update qualification plan.Description of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of Panel Level Package (PLP) packaging process technology available in 16L UQFN (3x3x0.5mm) and (4x4x0.5mm), 20L UQFN (4x4x0.5mm), 28L UQFN (4x4x0.55mm) and 40L UQFN (5x5x0.5mm) packages at NEPL assembly site.Reason for Change:To improve productivity, manufacturability, and cycle time by qualifying panel level package (PLP) packaging technology at NEPL assembly site.
CCB 1475 Initial Notice: Qualification of C194 lead-frame for selected QFN and UQFN packages at NSEB assembly site.Description of Change: Qualification of C194 lead-frame for 16L QFN (4x4x0.9mm), 16L QFN (3x3x0.9mm), 20L QFN (4x4x0.9mm), 28L QFN (6x6x0.9mm), 64L QFN (9x9x0.9mm), 28L UQFN (4x4x0.5mm) and 48L UQFN (6x6x0.5mm) packages at NSEB.Pre Change: EFTEC-64T lead framePost Change: EFTEC-64T or C194 lead frameNOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
