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Manufacturer Part #
R5F566TAADFP#30
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90 per Tray
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Description of Change: Applicable products: RX Family RX100/200/600/700 Series LQFP-64 and LFQFP-80/100/144 pin products.The back-end factory: Renesas Semiconductor (Beijing) Co., LtdChanges: The lead frame will be changed.Reason for Change: To ensure a stable supply.
Description of Change: Applicable products: RA RX family LQFP/LFQFP productsThe back-end factory: Renesas Electronics Corporation Beijing Factory (?Beijing?)Changes: The die-bond material will be changed.The new die-bond material is a proven one for mass production at ?Beijing?Reason for Change: To ensure a stable supply.
Description of Change: Change of lead frame. The wire length between the chip and lead frame inside the package is shortened at the inner lead portion. Package outline, die bond, mold resin and marking remain unchanged. Reason for Change: To ensure stable supply
Description of Change:Renesas will add full tray packaging to MCU products in addition to fractional and full carton.The standard shipping packaging using Renesas trays is a full carton (complete packaging). However, if the customer's order quantity is less than a full carton, we will change it to the full tray that will be added this time.Renesas plan to discontinue production of fractional tray packaging in the future.Regarding full tray production lot management, up to three production lots may be combined.Reason for Change:Stable supply of products, environmentally friendly response (improving packaging resource usage efficiency, reducing waste amount)
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
