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Manufacturer Part #
FBO16-12N
Download the CAD models for this product. Learn more about SnapMagic.
25 per Tube
ISOPLUS-I4-PAK
Through Hole
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Package type: Isoplus I4PacDescription:Littelfuse wants to inform you that we have completed the qualification process for an alternative DCB (Direct Copper Bonded) supplier for the Power Discrete I4Pac productsReason for Change:To enhance supply chain resilience and ensure uninterrupted business operationsEffective date : April 16th, 2026
Description:This letter serves as a notification to inform you that we are improving our packing methodology to eliminate the risk of product contamination by implementing a vacuum-sealed shielded bag. This improvement applies to power discrete parts that are currently packed in Tube only.Effective date : Jan 2, 2026
Description:This letter serves as a notification to inform you that we are improving our packing methodology to eliminate the risk of product contamination by implementing a vacuum-sealed shielded bag. This improvement applies to power discrete parts that are currently packed in Tube only.Form, fit, function changes : No changeEffective date : Jan 2, 2026
This is a updated declaration letter associated to ESW490-40 - IXYS Thy & Diode I4Pac&GUFP Package; ESW490-44 - IXYS Thy & Diode TO247_ISO247_PLUS247_ISOPLUS247Package; ESW490-47 - IXYS Thy & Diode SOT-227 Package; PCN # ESW490-48 ? IXYS Power Thyristor & Diode TO-263 Packaging Location Transfer. Littelfuse will change the MOQ/MDQ/DU for IXYS Power Thyristor & Diode products aligning to manufacture requirement.
This is a updated declaration letter associated to ESW490-40 - IXYS Thy & Diode I4Pac&GUFP Package; ESW490-44 -IXYS Thy & Diode TO247_ISO247_PLUS247_ISOPLUS247Package; ESW490-47 - IXYS Thy & Diode SOT-227 Package; PCN # ESW490-48 ? IXYS Power Thyristor & Diode TO-263 Packaging Location Transfer. Littelfuse will change the MOQ/MDQ/DU for IXYS Power Thyristor & Diode products aligning to manufacture requirement. Detail affected part number list refer to Appendix.
SUBJECT: Assembled Device Marking Format Changes and Outer Box/Bag Label Format Changes - Change to the assembled device marking format The change affects the date code and tracking number identification. This change does not affect the form, fit or function of the product. See attached for more details - Change to the box label format: The paper sticker label found on the outer box or bag will see a format change that incorporates the Littelfuse logo along with the IXYS logo. The printed information remains the same (PN, Qty, Lot #, date code, country of origin). The change allows for a improved readability. This change does not affect the form, fit or function of the product. REMARKS: This changes from the original IXYS Corporation marking/labeling format to the new IXYS LLC-USA format is being done to conform to the SAP product management system requirements of our parent company Littelfuse Corporation.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
