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Manufacturer Part #
IXFB60N80P
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25 per Tube
PLUS-264
Through Hole
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Description:This letter serves as a notification to inform you that we are improving our packing methodology to eliminate the risk of product contamination by implementing a vacuum-sealed shielded bag. This improvement applies to power discrete parts that are currently packed in Tube only.Effective date : Jan 2, 2026
Description:This letter serves as a notification to inform you that we are improving our packing methodology to eliminate the risk of product contamination by implementing a vacuum-sealed shielded bag. This improvement applies to power discrete parts that are currently packed in Tube only.Form, fit, function changes : No changeEffective date : Jan 2, 2026
UPDATE to PCN LFPCN-DMI-BTA-2024-002/01, Future PCN 107857.This PCN is a revised version of the previously issued PCN LFPCN-DMI-BTA-2024-002/01, dated September 18, 2024, which informed you of an additional backend manufacturing site for the discrete MOSFET and IGBT parts listed in Appendix C. This updated version includes change in lead finish.DESCRIPTION OF CHANGE: 1. Addition of in-house assembly line in Lipa as a new supplier and alternative source for TO-264, PLUS264 and ISOPLUS264 (ISOPLUS i5-PAC) packages. This will further streamline and enhance our supply chain efficiencies.2. Change in device marking: Details under APPENDIX A.3. Change in inner box and tube labels, and tube dimensions: Details under APPENDIX A.4. Change in lead finish: Details under APPENDIX A.New country of origin: Philippines
**FPCN 108839 UPDATE with additional part list**
DESCRIPTION OF CHANGE:1. Addition of in-house assembly line in Lipa as a new supplier and alternative source for TO-264, PLUS264 and ISOPLUS264 (ISOPLUS i5-PAC) packages. This will further streamline and enhance our supply chain efficiencies.2. Change in device marking: Details under APPENDIX A.3. Change in inner box and tube labels, and tube dimensions: Details under APPENDIX A.
SUBJECT: Assembled Device Marking Format Changes and Outer Box/Bag Label Format Changes - Change to the assembled device marking format The change affects the date code and tracking number identification. This change does not affect the form, fit or function of the product. See attached for more details - Change to the box label format: The paper sticker label found on the outer box or bag will see a format change that incorporates the Littelfuse logo along with the IXYS logo. The printed information remains the same (PN, Qty, Lot #, date code, country of origin). The change allows for a improved readability. This change does not affect the form, fit or function of the product. REMARKS: This changes from the original IXYS Corporation marking/labeling format to the new IXYS LLC-USA format is being done to conform to the SAP product management system requirements of our parent company Littelfuse Corporation.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
