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TN2130K1-G
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Product Category: Depletion Mode Mosfets, N-Channel Enhancement Mode Mosfets, P-Channel Enhancement Mode MosfetsNotification Subject: CCB 8332 Initial Notice: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for 2N7002-G, DN1509T-V/C6X, DN3135K1-G, LND150K1-G, LND250K1-G, TN2106K1-G, TN2124K1-G, TN2124K1-G-D545, TN2130K1-G, TN5325K1-G, TN5335K1-G, TN5335K1-G-D589, TP0610T-G, TP2104K1-G, TP5322K1-G, TP5335K1-G, TP5335K1-G-AAA, TP5335K1-G-D588, VN2110K1-G, VP2110K1-G and VP2110K1-G-D537 catalog part numbers (CPN) available in 3L SOT-23 (1.3mm) package at MTAI assembly site.Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for 2N7002-G, DN1509T-V/C6X, DN3135K1-G, LND150K1-G, LND250K1-G, TN2106K1-G, TN2124K1-G, TN2124K1-G-D545, TN2130K1-G, TN5325K1-G, TN5335K1-G, TN5335K1-G-D589, TP0610T-G, TP2104K1-G, TP5322K1-G, TP5335K1-G, TP5335K1-G-AAA, TP5335K1-G-D588, VN2110K1-G, VP2110K1-G and VP2110K1-G-D537 catalog part numbers (CPN) available in 3L SOT-23 (1.3mm) package at MTAI assembly site.Pre and Post Summary Changes:See attached SPCN document for more detailsReason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material at MTAI assembly site.Estimated Qualification Completion Date: August 2026
*** Update for PCN 111842 /Location Change***Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication site for multiple device families of DMOS2.5 (63K, 6K, 6FK, 6GK, 6HK) technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 08 October 2025 (date code: 2541)Revision History: March 26, 2025: Issued initial notification. September 04, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on October 08, 2025.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication site for multiple device families of DMOS2.5 (63K, 6K, 6FK, 6GK, 6HK) technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: July 2025
Microchip has released a new Datasheet for the TN2130 N-Channel Enhancement-Mode Vertical DMOS FET Data Sheet of devices. Notification Status: FinalDescription of Change:? Added 6-Lead DFN package to Package Type, Pin Function Table and Product Identification System.? Updated Absolute Maximum Ratings(?).? Updated Section 5.1, Package Marking Information.? Made minor text changes throughout the document.Impacts to Data Sheet: See above details.Change Implementation Status: CompleteReason for Change: To Improve ProductivityDate Document Changes Effective: 15 Mar 2023
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