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Manufacturer Part #
342950-COPPER SKIVFIN
Heat Sinks Square, Skived Fin Heat Sink for BGA/FPGA, 2.3mm Thickness, 10mm Heig
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| Mfr. Name: | Boyd | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:9 per Tray | ||||||||||
| Date Code: | |||||||||||
Product Specification Section
Boyd 342950-COPPER SKIVFIN - Product Specification
Shipping Information:
Item cannot ship to certain countries. See List
Item cannot ship to following countries:
ECCN:
EAR99
PCN Information:
N/A
File
Date
Part Status:
Active
Active
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=342950-COPPER SKIVFIN&field4=Boyd&field18=https://p1na.futureelectronics.com/p/electromechanical--thermal-management--heatsinks-accessories/342950-copper-skivfin-boyd-6187786
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=342950-COPPER SKIVFIN&field4=Boyd&field18=https://p1na.futureelectronics.com/p/electromechanical--thermal-management--heatsinks-accessories/342950-copper-skivfin-boyd-6187786
Pricing Section
Global Stock:
0
USA:
0
On Order:
0
Factory Lead Time:
18 Weeks
Quantity
Unit Price
9+
$56.36
Product Variant Information section
Available Packaging
Package Qty:
9 per Tray