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Manufacturer Part #

AS0B326-S78N-7F

As0B3 Series 230 Position 0.5 mm Pitch SMT Edgecard Connector

ECAD Model:
Mfr. Name: Foxconn Interconnect Technology
Standard Pkg:
Product Variant Information section
Date Code: 2019
Product Specification Section
Technical Attributes
Attributes Table
Type: Board to Board (Backplane)
Style/Orientation: Straight
No of Positions: 230
No of Rows: 1
Pitch: 0.5 mm
Termination: Solder
Material: Thermoplastic Resin
Contact Plating: Gold
Contact Resistance: 40mΩ
Current Rating: 0.5A
Operating Temp Range: -40°C to +85°C
Voltage Rating: 50V
Color: Ivory
Mounting Method: PCB Mount
Pricing Section
Global Stock:
0
USA:
0
267,460
Factory Stock:Factory Stock:
0
Factory Lead Time:
14 Weeks
Minimum Order:
430
Multiple Of:
430
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Tariff charges may apply if shipping to the United States. An estimate of tariff charges will be calculated at checkout.
Total
$2,911.10
USD
Quantity
Web Price
430+
$6.77
Product Variant Information section