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SY89809ALTZ
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250 per Tray
TQFP-32
Surface Mount
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*** Update of FPCN 115179 , 121897 & 122144 /MULTIPLE CHANGE***Revision History: Note: See attached SPCN document for more Revision historyJune 25, 2026: Re-issued the final notification to include notes on the impacts to datasheet.Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected SY8929xx, SY8770xx, SY8773xx, SY6975xx, SY8953xx, SY8772xx, SY100Exx, SY8922xx, SY8920xx, SY8983xx, SY8911xx, SY8947xx, SY8954xx, SY8985xx, SY8899xx, SY8923xx, SY8987xx, SY8984xx, SY8946xx, SY8971xx, SY8980xx, SY8814xx, SY8834xx, SYCUSTxx, SY8478xx, SY5585xx, SY5862xx, SY8893xx, SY8964xx, SY8921xx, SY8890xx, SY8931xx, SY8932xx, SY8877xx, SY8411xx, SY8830xx, SY8840xx and SY8835xx device families of 2DK technology available in various packages.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: 23 December 2026Estimated First Ship Date: 18 June 2026 (date code: 2625)
*** Update of FPCN 115179 & 121897 ***Revision History: August 07, 2025: Issued initial notification.June 08, 2026: Issued final notification. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Provided estimated first ship date to be on June 18, 2026.June 22, 2026: Re-issued final notification. Revised the PCN Timetable Summary to update the "Qual Report Availability" to December 23, 2026 (Week 52)Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected SY8929xx, SY8770xx, SY8773xx, SY6975xx, SY8953xx, SY8772xx, SY100Exx, SY8922xx, SY8920xx, SY8983xx, SY8911xx, SY8947xx, SY8954xx, SY8985xx, SY8899xx, SY8923xx, SY8987xx, SY8984xx, SY8946xx, SY8971xx, SY8980xx, SY8814xx, SY8834xx, SYCUSTxx, SY8478xx, SY5585xx, SY5862xx, SY8893xx, SY8964xx, SY8921xx, SY8890xx, SY8931xx, SY8932xx, SY8877xx, SY8411xx, SY8830xx, SY8840xx and SY8835xx device families of 2DK technology available in various packages.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. Note: See attached SPCN document for more detailsEstimated Qualification Completion Date: 23 December 2026Estimated First Ship Date: 18 June 2026
*** Update of FPCN 115179 ***Revision History: August 07, 2025: Issued initial notification.June 08, 2026: Issued final notification. Added a Change (Yes/No) column to the Pre and Post Change Summary table. Provided estimated first ship date to be on June 18, 2026.Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected SY8929xx, SY8770xx, SY8773xx, SY6975xx, SY8953xx, SY8772xx, SY100Exx, SY8922xx, SY8920xx, SY8983xx, SY8911xx, SY8947xx, SY8954xx, SY8985xx, SY8899xx, SY8923xx, SY8987xx, SY8984xx, SY8946xx, SY8971xx, SY8980xx, SY8814xx, SY8834xx, SYCUSTxx, SY8478xx, SY5585xx, SY5862xx, SY8893xx, SY8964xx, SY8921xx, SY8890xx, SY8931xx, SY8932xx, SY8877xx, SY8411xx, SY8830xx, SY8840xx and SY8835xx device families of 2DK technology available in various packages.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: 01 June 2028Estimated First Ship Date: 18 June 2026 (date code: 2625)
EOL Description: The SY100EL34LZG, SY100EL34LZG-TR, SY100EL90VZG, SY100EL92ZG, SY56023RMG, SY56216RMG, SY58027UMG, SY87729LHY, SY88029LMG-TR, SY88353BLMG, SY88353BLMG-TR, SY88773VMG, SY88922VKG, SY89218UHY, SY89251VMG-TR, SY89809ALTZ, SY898533LKZ, SY898533LKZ-TR and ZL40225LDG1 catalog part numbers (CPN) will be moving to End of Life (EOL) status effective today. This catalog part numbers will no longer be offered after October 16, 2026.Reason for EOL: No longer have manufacturing support for the CPN listed in the attachment. Last Date for Bookings (LTB): 17 April 2026Last Date for Shipments LTS: 16 October 2026
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected SY8929xx, SY8770xx, SY8773xx, SY6975xx, SY8953xx, SY8772xx, SY100Exx, SY8922xx, SY8920xx, SY8983xx, SY8911xx, SY8947xx, SY8954xx, SY8985xx, SY8899xx, SY8923xx, SY8987xx, SY8984xx, SY8946xx, SY8971xx, SY8980xx, SY8814xx, SY8834xx, SYCUSTxx, SY8478xx, SY5585xx, SY5862xx, SY8893xx, SY8964xx, SY8921xx, SY8890xx, SY8931xx, SY8932xx, SY8877xx, SY8411xx, SY8830xx, SY8840xx and SY8835xx device families of 2DK technology available in various packages.Wafer Size changed from 8" to 6"Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Estimated Qualification Completion Date: January 2026
**Update to previous FPCN 98050******Revise affected parts list to remove SY89829UHY, SY89829UHY-TR and SY55856UHG catalog part number since these parts were EOL?ed****Description of Change:Qualification of UNIG as a new final test site for various products available in Tube and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Description of Change:Qualification of UNIG as a new final test site for various products available in Tube and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
