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Manufacturer Part #
24AA16T-E/OT
I2C EEPROM, 16K (2X8), 1.8V-5.5V, SOT23, EXTENDED TEMP
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| Mfr. Name: | Microchip | ||||||||||
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Product Variant Information section
Available PackagingPackage Qty:3000 per Reel Mounting Method:Surface Mount |
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Microchip 24AA16T-E/OT - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
Description of Change:Microchip has released a new Datasheet for the 24AA16/24LC16B/24FC16 - 16-Kbit I?C Serial EEPROM of devices.Added 4 million E/W cycles for FC devices only; Minor editorial updates throughout the document.Reason for Change: To Improve Productivity.Date Document Changes Effective: 02 Oct 2025
**Update to FPCN113837**Revision History: June 20, 2025: Issued initial notification. August 08, 2025: Issued final notification. Attached the Qualification Report. Provided the estimated first ship date to be on August 31, 2025.Description of Change: Qualification of CuPdAu as a new wire material for selected 24AA01x, 24AA02x, 24AA04x, 24AA08x, 24AA16x, 24FC01, 24FC02, 24FC04x, 24FC08, 24FC16x, 24LC01Bx, 24LC02Bx, 24LC04Bx, 24LC08Bx, 24LC16Bx, AT24C01D, AT24C02D, AT24C04D, AT24C08D, AT24C16D and AT24C32E device families available in 5L SOT-23 package.Reason for Change: To improved manufacturability by qualifying CuPdAu as a new wire material.
Description of Change:Qualification of CuPdAu as a new wire material for selected 24AA01x, 24AA02x, 24AA04x, 24AA08x, 24AA16x, 24FC01, 24FC02, 24FC04x, 24FC08, 24FC16x, 24LC01Bx, 24LC02Bx, 24LC04Bx, 24LC08Bx, 24LC16Bx, AT24C01D, AT24C02D, AT24C04D, AT24C08D, AT24C16D and AT24C32E device families available in 5L SOT-23 package.Pre and Post Summary Changes: See attachedImpacts to Datasheet: NoneChange Impact: NoneReason for Change:To improved manufacturability by qualifying CuPdAu as a new wire material.Change Implementation Status: In ProgressEstimated Qualification Completion Date: July 2025Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Timetable Summary: See attached
***FPCN108989 UPDATE***Description of Change: Qualification of 8008MD as a new die attach material and CuPdAu as a new wire material for selected various products available in 5L SOT-23 package assembled at MTAI.Revision History: November 18, 2024: Issued initial notification.January 27, 2025: Issued final notification. Attached the Qualification Report. Provided Estimated firstship date to be on February 28, 2025.Reason for Change: To improve manufacturability by qualifying 8008MD as a new die attach materialand CuPdAu as a new wire material
Description of Change: Qualification of 8008MD as a new die attach material and CuPdAu as a new wire material for selected various products available in 5L SOT-23 package assembled at MTAI.Reason for Change: To improve manufacturability by qualifying 8008MD as a new die attach material and CuPdAu as a new wire material
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8008MD as a new die attach material for selected 24LCxxx, 24AAxxx and 24FCxxx device families available in 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8008MD as a new die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:August 20, 2024 (date code: 2434)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 24LCxxx, 24AAxxx and 24FCxxx device families available in 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Part Status:
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Microchip 24AA16T-E/OT - Technical Attributes
| Memory Density: | 16kb |
| Memory Organization: | 2 K x 8 |
| Supply Voltage-Nom: | 1.7V to 5.5V |
| Clock Frequency-Max: | 400kHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3000 per Reel
Mounting Method:
Surface Mount