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Manufacturer Part #
23LCV1024T-I/SN
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3300 per Reel
SOIC-8
Surface Mount
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***UPDATE OF PCN118083***Revision History: December 15, 2025: Issued initial notification. April 15, 2026: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on May 22, 2026.Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material selected 23A1024, 23A512, 23LC1024, 23LC512, 23LCV1024 and 23LCV512 device families available in 8L SOIC (.150in) package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire materialEstimated First Ship Date: 22 May 2026 (date code: 2621)
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material selected 23A1024, 23A512, 23LC1024, 23LC512, 23LCV1024 and 23LCV512 device families available in 8L SOIC (.150in) package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Change Implementation Status: In ProgressEstimated Qualification Completion Date: February 2026
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Part Status:
On Order
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.