Manufacturer Part #
CYUSB3014-BZXC
EZ-USB FX3 Series ARM9 512K 1.15V to 1.25V External Program Memory IC FBGA-121
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| Mfr. Name: | Infineon | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:168 per Tray Package Style:TFBGA-121 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2501 | ||||||||||
Product Specification Section
Infineon CYUSB3014-BZXC - Product Specification
Shipping Information:
Item cannot ship to certain countries. See List
Item cannot ship to following countries:
ECCN:
3A991.a.2
This item may be subject to export licensing controls.
PCN Information:
File
Date
Packaging Process Change
08/14/2025 Details and Download
Description:Extension of total storage time of Finished Goods to 5 years for SMD (Surface Mount Devices) and WLCSP (Wafer Level Chip-Scale Package) packagesReason Infineon able to improve our Finished Goods storage from 2 years to 5 years without having any impact to quality and performance.Intended start of delivery - 2025-09-30
Labeling Change
02/11/2025 Details and Download
Labeling Change
12/14/2023 Details and Download
Part Status:
Active
Active
Infineon CYUSB3014-BZXC - Technical Attributes
Attributes Table
| Supply Voltage-Nom: | 1.15V to 1.25V |
| Interface: | I2C |
| Data Rate: | 4Mbps |
| Supply Current: | 200mA |
| Operating Temp Range: | 0°C to 70°C |
| Storage Temperature Range: | -65°C to +150°C |
| No of Terminals: | 121 |
| Moisture Sensitivity Level: | 3 |
| Package Style: | TFBGA-121 |
| Mounting Method: | Surface Mount |
Pricing Section
Global Stock:
952
USA:
952
Factory Lead Time:
13 Weeks
Quantity
Unit Price
1
$19.97
3
$19.70
5
$19.57
20
$19.24
30+
$19.02
Product Variant Information section
Available Packaging
Package Qty:
168 per Tray
Package Style:
TFBGA-121
Mounting Method:
Surface Mount