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DSPIC33CK512MP606-I/PT
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160 per Tray
TQFP-64
Surface Mount
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Product Category: 32-Bit Microcontrollers, Digital Signal ControllersNotification Subject: CCB 8307 Initial Notice: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected various device families available in 48L TQFP (7x7x1mm), 64L TQFP (10x10x1mm), 80L TQFP (12x12x1mm) and 100L TQFP (12x12x1mm) packages at MTAI assembly site.Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected various device families available in 48L TQFP (7x7x1mm), 64L TQFP (10x10x1mm), 80L TQFP (12x12x1mm) and 100L TQFP (12x12x1mm) packages at MTAI assembly site.Pre and Post Summary Changes: See attached SPCN document for more detailsReason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Change Implementation Status: In ProgressEstimated Qualification Completion Date: June 2026
Description of Change:Microchip has released a new Document for the dsPIC33CK512MP608 Family Silicon Errata and Data Sheet Clarification of devices.Removed all data sheet clarifications.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 20 May 2026
Product Category: Digital Signal ControllersDescription of Change:? Sections:? Updated High-Resolution PWM with Fine Edge Placement, Communication Interfaces, Referenced Sources, 2.6. External Oscillator Layout Guidance, 3.3. Data Space Addressing, 4.2. Data Address Space, 5.4. ECC Fault Injection, 6. Resets, 6.1.1. Key Resources, 10.1.1. Source and Destination, 14.1. Overview, 18. Inter-Integrated Circuit (I2C), 19. Parallel Master Port (PMP), 22.1. Time Base Generator, 29. Power-Saving Features, 29.5.1. Key Resources, 30.6. Brown-out Reset (BOR), 30.8. JTAG Interface and 30.9. In-Circuit Debugger.FOR MORE DESCRIPTION CHANGES REFER TO SPCN DOCUMENT ATTACHEDReason for Change: To Improve Productivity Date Document Changes Effective: 30 Apr 2026
Description of Change:Microchip has released a new Document for the dsPIC33CK512MP608 Family Silicon Errata and Data Sheet Clarification of devices.Updated data sheet clarifications 17 (ADC), 18 (ADC), 19 (Electrical Characteristics), 20 (HighTemperature Electrical Characteristics) and 22 High-Resolution PWM with Fine-Edge Placement. Added data sheet clarifications 27 (High-Temperature Electrical Characteristics), 32 (Electrical Characteristics), 33 (High-Temperature Electrical Characteristics), 34 (I/O Ports), 35 (ADC), 36 (DAC), 37 (High-Temperature Electrical Characteristics), 38 Watchdog Timer Delta Current, 39 Electrical Characteristics, 40 Timer 1, 41 I2C, 42 PWM, 43 PMD, 44 ADC, 45 CCP, 46 Oscillator, 47 Current Bias Generator, 48 QEI, 49 DMT, 50 SPI, 51 Interrupt Controller, 52 CPU, 53 Ports, 54 DMA, 55 CAN, 56 DAC, 57 SENT, 58 WDT and 59 PTG.Reason for Change: To Improve ProductivityDate Document Changes Effective: 16 Mar 2026
Product Category: Digital Signal ControllersNotification Subject: dsPIC33CK512MP608 Family Silicon Errata and Data Sheet ClarificationDescription of Change:- Added silicon revision A1. - Added data sheet clarifications 13 (Product identification System), 14 (Oscillator), 15 (Electrical Characteristics), 16 (ADC), 17 (ADC), 18 (ADC), 19 (Electrical Characteristics), 20 (High-Temperature Electrical Characteristics), 21 (High-Temperature Electrical Characteristics), 22 (High-Resolution PWM with Fine-Edge Placement), 23 (High-Speed Analog Comparator with Slope Compensation DAC), 24 (Resets), 25 (Electrical Characteristics), 26 (Electrical Characteristics), 27 (Quadrature Encoder Interface (QEI)), 28 (Controller Area Network Flexible Data-Rate (CAN FD) Modules), 29 Electrical Specifications and 30 Electrical Specifications.Reason for Change: To Improve ProductivityEstimated First Ship Date: 23 February 2026
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Microchip has released a new Document for the dsPIC33CK512MP608 Family Silicon Errata and Data Sheet Clarification of devices. If you are using one of these devices please read the document located at dsPIC33CK512MP608 Family Silicon Errata and Data Sheet Clarification.Notification Status: FinalDescription of Change:Added silicon issue 9 (Reset).Added data sheet clarifications 1 (Flash Program Memory), 2 (I/O Ports), 3 (I/O Ports), 4 (Direct Memory Access (DMA) Controller), 5 (Controller Area Network Flexible Data Rate (CAN FD) Modules), 6 (I2C), 7 (I2C), 8 (Electrical Characteristics), 9 (Electrical Characteristics), 10 (Special Features), 11 (Product Identification System), and 12 (Packaging Information).Impacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 07 Feb 2024NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices::N/A
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