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Manufacturer Part #
CY8C6347BZI-BLD53
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3640 per Tray
BGA-116
Surface Mount
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Description:i. PACKING/SHIPPING-Change of labelling (applicable for all products)ii. PROCESS-ASSEMBLY Change of marking(applicable on the selected packages)Reason:To support a uniform product identification and labeling approach across the portfolio, marking and labels are being aligned with Infineon standards.Intended start of delivery 2026-10-30
Subject: Harmonization of marking and label across product portfolios as per Infineon standards.Description:Old:BE Part Rev and FE Fab Code Leadfree Indicator except for BGA packages Existing lot code nomenclature Existing site code Country of Origin (full country name)New: Exclusion of BE Part Rev and FE Fab CodeExclusion of Leadfree Indicator except for BGA packages Standardization to Infineon Lot code Infineon site code Standardization of the Country of OriginNote: For more information refer the SPCN document Reason: To support a uniform product identification and labeling approach across the portfolio, marking and labels are being aligned with Infineon standards. Intended start of delivery 2026-10-30
Subject:Flash Boot firmware update and SRAM size alignment to data sheet for PSOC 63xx devices. Description:Old:- Incomplete configuration flow for FllDisable function for PSOC 63xx MPNs - Flash boot version 1.20.1.45- PSOC 63x6 SRAM size 288KB New:- Correct implementation of FllDisable function for PSOC 63xx MPNs - Flash boot version 1.20.1.53 - Align PSOC 63x6 SRAM size 128KB as per data sheetReason:In extremely rare circumstances, on the order of once every 10,000 -100,000+ reset or power cyceles, during boot the device may enter an infinte fault handler loop (never reaches application code). So the device may not transition from boot to application code. This issue occurs only if TOC2 (table of contents #2) is instantiated in Sflash by user. TOC2 is used for secure lifecycle stage or to alter boot-time defaults in normal lifecycle stage. Flash boot version 1.20.1.53 resolves the issue Additionally, align the SRAM size for PSOC 63x6 to match datasheet.
Description of Change:Extend total storage time to 5 years for SMD and WLx packages.*Old: Maximum storage time is either 2 or 3 years*New: Maximum storage time is 5 yearsReason for Change:Enable longer storage time.Impact Of Change:Technical risk assessment and solderability tests done.No impact seen.Remark: There is change of packing material or bill of material.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
