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Manufacturer Part #
CYUSB3065-BZXC
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240 per Tray
BGA-121
Surface Mount
Shipping Information:
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PCN Information:
Description:i. PACKING/SHIPPING-Change of labelling (applicable for all products)ii. PROCESS-ASSEMBLY Change of marking(applicable on the selected packages)Reason:To support a uniform product identification and labeling approach across the portfolio, marking and labels are being aligned with Infineon standards.Intended start of delivery 2026-10-30
Subject: Harmonization of marking and label across product portfolios as per Infineon standards.Description:Old:BE Part Rev and FE Fab Code Leadfree Indicator except for BGA packages Existing lot code nomenclature Existing site code Country of Origin (full country name)New: Exclusion of BE Part Rev and FE Fab CodeExclusion of Leadfree Indicator except for BGA packages Standardization to Infineon Lot code Infineon site code Standardization of the Country of OriginNote: For more information refer the SPCN document Reason: To support a uniform product identification and labeling approach across the portfolio, marking and labels are being aligned with Infineon standards. Intended start of delivery 2026-10-30
Subject: Change of company logo on tray.Description:Old - ASE company logo New- Hwa Shu company logoReason: Change of ownership for tray manufacturer, thus the logo of the new company will replace the old logo. The dimensions of the tray remain unchanged.
Description:Extension of total storage time of Finished Goods to 5 years for SMD (Surface Mount Devices) and WLCSP (Wafer Level Chip-Scale Package) packagesReason Infineon able to improve our Finished Goods storage from 2 years to 5 years without having any impact to quality and performance.Intended start of delivery - 2025-09-30
Part Status:
On Order
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.