Manufacturer Part #
Single-Chip 5G MAC/Baseband/Radio with Integrated Bluetooth 4.1 for Automotive
Description of Change: Cypress announces the qualification of Powertech Technology Inc. (PTI-SG - 12 Ang Mo Kio Street 65, Singapore 569060) as an additional bumping, wafer sort, backend and finish site for select WLCSP products. PTI-SG is the only 300mm wafer bumping facility in Singapore. This qualification will allow Cypress to leverage PTI-SG's manufacturing expertise and quality focus. PTI-SG is certified on several international quality standards: IATF16949, ISO9001, ISO14001 and OHSAS18001. Cypress also announces the qualification of an alternate source for carrier tape and cover tape for the select WLCSP products. ? No changes in carrier tape dimensions and materials for all the affected packages except a minor improvement on Ao. Bo & Ko for WLCSP151 4.91x5.85x0.55 mm. Refer to attachment for drawing 151-Ball WLCSP (4.91x5.85x0.55 mm). ? Cover tape type changed from pressure seal to heat seal. Benefit of Change: Qualification of alternate manufacturing sites is part of the ongoing flexible manufacturing initiative announced by Cypress. The goal of the flexible manufacturing initiative is to provide the means for Cypress to continue to meet delivery commitments through dynamic, changing market conditions.
Cypress announces a change in the package top-marking for the Standard IoT WLCSP packages. Following are the details of changes. 1) Add Wafer ID Number to the existing marking format to improve unit traceability. 2) Change die location format from "CC-RR" to "CCC-RRR" for some of the packages. 3) Change Assembly lot number from 6 digits to 5 digits for some of the packages. The full details of the marking change for each package is shown in the attached "IoT WLCSP Marking Change" document. This is a top marking change only. There are no changes to the assembly process, product specifications and ordering part numbers. Product datasheets remain the same and can be downloaded from the Cypress Website (www.cypress.com). Benefit of Change: The addition of Wafer ID number on the product marking will improve unit traceability. Approximate Implementation Date: This change will be implemented effective with the date of this notification. For some of these part numbers, Cypress has existing inventory that is marked with the old marking. Until this inventory is depleted, products with the old marking will continue to ship. Anticipated Impact: Products manufactured are completely compatible with existing product from form, fit, functional, parametric, and quality performance perspectives. Cypress also recommends that customers take this opportunity to review these changes against current application notes, system design considerations and customer environment conditions to assess impact (if any) to their application.
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization Description of Change: The purpose of this addendum is to correct the date from January 20, 2019 to January 20, 2020, in the "3rd paragraph in the 'Description of Change' section. This notification is to inform customers that Cypress will be standardizing its manufacturing labels and tray/tube packing configuration. It may be recalled that the Cypress entity consolidation (following the merger with Spansion Corp) was announced via Product Information Notification PIN174801 in November 2017. As the next phase of the entity consolidation process, Cypress will be adapting a new manufacturing label format for all products and revising shipping configurations for select product shipped in trays and tubes.