Pays de livraison
Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
Pays sélectionné
Référence fabricant
MIC2506YM
Tèlèchargez les modèles CAD pour ce produit. En savoir plus sur SnapMagic.
95 par Tube
SOIC-8
Surface Mount
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material, G700LTD as a new mold compound material and 8303A as a new die attach material for MIC5011YM, MIC2193YM, MIC2193YM-TR, MIC2194YM-TR, MIC2196YM, MIC2196YM-TR, MIC5011YM-TR, MIC5013YM, MIC5013YM-TR, MIC2194YM, MIC2505YM, MIC2505YM-TR, MIC2506YM, MIC2506YM-TR, MIC4422AYM-TR, MIC4422YM, MIC4422YM-TR, MIC4422ZM, MIC4451YM, MIC4452VM, MIC4452VM-TR, SPN040028G, MIC4452YM-TR, MIC4451YM-TR, MIC4452YM, MIC4421ZM, MIC4421ZM-TR, MIC4422ZM-TR, MIC2505-1YM, MIC4421AZM-TR, MIC2505-2YM, MIC2505-2YM-TR, MIC4421YM, MIC4421YM-TR, MIC2505-1YM-TR, MIC4422AZM, MIC4422AZM-TR, MIC4422AYM, MIC4421AZM, MIC4421AYM, MIC4421AYM-TR and MIC4421AXM-TR catalog part numbers (CPN) available in 8L SOIC (.150in) package assembled at STAR site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material, G700LTD as a new mold compound material and 8303A as a new die attach material.
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Statut du produit:
Sur commande
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
