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Manufacturer Part #
MIC39500-1.8WU-TR
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750 per Std. Mfr. Pkg
TO-263-3 (D2PAK)
Surface Mount
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HTS Code:
ECCN:
PCN Information:
Description of Change:Qualification of KF site as a new BGBM (Backside grinding/metallization) chipbond site for selected HV2815, HV2070, HV2607, HV2707, HV2708, HV2803, HV2818, HV2903, HV2904, HV2915, HV2916, HV2918, HV7322, HV7358, LM2575, LM2576, MIC2171, MIC29150, MIC29151, MIC29152, MIC29201, MIC29202, MIC29203, MIC29204, MIC2920A, MIC29300, MIC29301, MIC29302, MIC29302A, MIC29302H, MIC29303, MIC29310, MIC29312, MIC29371, MIC29372, MIC2937A, MIC2940A, MIC2941A, MIC29500, MIC29501, MIC29502, MIC29503, MIC29510, MIC29512, MIC2954, MIC29712, MIC29751, MIC29752, MIC35302, MIC37100, MIC37102, MIC37150, MIC37151, MIC37152, MIC37252, MIC37300, MIC37301, MIC37302, MIC37501, MIC37502, MIC39100, MIC39101, MIC39150, MIC39151, MIC39152, MIC39300, MIC39301, MIC39302, MIC39500, MIC39501, MIC4574, MIC4575, MIC4576, MIC4685, MIC47150, MIC47300, MIC49150, MIC49200, MIC49300, MIC49500, MIC59300, MIC69301, MIC69302, MIC69502, MIC94050 and MIC94051 device families available in various packages.Reason for Change:To improve manufacturability by qualifying KF site as a new BGBM (Backside grinding/metallization) chipbond site.
UPDATE TO PCN 110887.Revision History: February 14, 2025: Issued initial notification.September 10, 2025: Issued final notification. Updated scope to remove MIC5200, MIC5201, MIC5202 device families and MIC5841YV-TR catalog part number and add 835-5043, LP2951, MIC2172, MIC2915x, MIC2920x, MIC2930xx, MIC2931x, MIC29371, MIC2941A, MIC29502, MIC2951, MIC2951x, MIC2954, MIC297xx, MIC2981, MIC3172, MIC37252, MIC37303, MIC3750x, MIC38C43, MIC38HC4x, MIC3915x, MIC3930x, MIC3950x, MIC3975, MIC457x, MIC501x, MIC502x, MIC5060, MIC515x, MIC580x and MIC58Pxx device families. Attached Qualification Report. Provided estimated first ship date to be on October 31, 2025.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.