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Manufacturer Part #
MCP2562FD-E/SN
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100 per Tube
SOIC-8
Surface Mount
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PCN Information:
*** Update of FPCN118511/ FPCN118604 - Material Change***Revision History: January 16, 2026: Issued initial notification. January 19, 2026: Re-issued initial notification to update notification subject.May 19, 2026: Issued final notification. Updated the affected parts list to include CPN MCP2562T-H/SNVAO. Provided estimated first ship date to be on June 05, 2026. Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for selected MCP2542FD, MCP2542WFD, MCP2544FD, MCP2544WFD, MCP2557FD, MCP2558FD, MCP2561, MCP2561FD, MCP2562 and MCP2562FD device families available in 8L SOIC (.150in) package.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach to standardize the use of PFAS free material at MTAI assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: 15 July 2026Estimated First Ship Date: 05 June 2026 (date code: 2623)
***UPDATE OF PCN118511 (NOTICE TYPE MATERIAL CHANGE) ***Revision History: January 16, 2026: Issued initial notification. January 19, 2026: Re-issued initial notification to update notification subject.Product Category: Interface- Controller Area Network (CAN)Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for selected MCP2542FD, MCP2542WFD, MCP2544FD, MCP2544WFD, MCP2557FD, MCP2558FD, MCP2561, MCP2561FD, MCP2562 and MCP2562FD device families available in 8L SOIC (.150in) package.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach to standardize the use of PFAS free material at MTAI assembly site.Estimated Qualification Completion Date: May 2026
Product Category: Interface- Controller Area Network (CAN)Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for selected MCP2542FD, MCP2542WFD, MCP2544FD, MCP2544WFD, MCP2557FD, MCP2558FD, MCP2561, MCP2561FD, MCP2562 and MCP2562FD device families available in 8L SOIC (.150in) package.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach to standardize the use of PFAS free material at MTAI assembly site.Estimated Qualification Completion Date: May 2026Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
