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Manufacturer Part #
MSC030SDA070BCT
Schottky Diodes Rectifiers SIC SBD 700 V 30 A TO-247
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:30 per Tube Package Style:TO-247-3 Mounting Method:Through Hole | ||||||||||
| Date Code: | 2207 | ||||||||||
Microchip MSC030SDA070BCT - Product Specification
Shipping Information:
ECCN:
PCN Information:
***UPDATE OF PCN111361***Description:Implement packing material changes for selected PSDS and SIC products available on TO-220, TO-247 and TO-263 packages at FSTS final test site.Reason for Change: To improve productivity by implementing packing material changes for selected PSDS and SIC products.Estimated First Ship Date: 16 June 2025 (date code: 2525)Revision History: March 06, 2025: Issued initial notification.June 9, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 16, 2025.
Description of Change:Implement packing material changes for selected PSDS and SIC products available in SOT-227, TO-220, TO-247, TO-263 and TO-268 packages at FSTS and TEAM final test sites.Reason for Change:To improve productivity by implementing packing material changes for selected PSDS and SIC products.
***June 27, 2024: Re-issued final notification. Updated the affected parts list to include CPN MSC035SMA070BV01 based on the updated scope***Description of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Revision History:February 26, 2024: Issued initial notification.May 24, 2024: Issued final notification. Revised the affected parts list. Provided estimated first ship date to be on June 29, 2024.Description of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Revision History:September 22, 2022: Issued initial notification.May 9, 2023: Issued final notice. Attached the qualification report and included the estimated first ship date on May 30, 2023.Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as an additional fabrication site for 700V and 1200V SiC Schottky Barrier Diode (SBD) products of MSC010SDA070xx, MSC010SDA120xx, MSC015SDA120xx, MSC020SDA120xx, MSC030SDA070xx, MSC030SDA120xx,MSC030SDB070B, MSC050SDA070xx, MSC050SDA120xx, MSC2X1xxSDA070J, MSC2X1xxSDA120J, MSC2X21DC120J, MSC2X3xSDA070J, MSC2X3xSDA120J, MSC2X5xSDA070J, MSC2X5xSDA120J, MSC2X61DC120J device families available in die sales products, 2L TO-268, 2L TO-220, 2L TO-247, and 4L SOT-227 packages.Reason for Change:To improve on-time delivery performances by qualifying MSCO as an additional fab site.
PCN Status:Final NotificationDescription of Change:Implement top marking changes for selected PSDS (Power Switching Discrete Solutions) Silicon Carbide (SiC) Products available in TO-247, TO-263, TO-268, TO-220 and SOT-227 packages.Reason for Change:To improve productivity by standardizing the top marking as part of the integration of Microsemi and Microchip.Change Implementation Status:In ProgressEstimated First Ship Date:March 31, 2023 (date code: 2313)
PCN Status:Final NotificationPCN Type:Manufacturing ChangeMicrochip Parts Affected:Please open one of the files found in the Affected CPNs section.Note: For your convenience Microchip includes identical files in two formats (.pdf and .xls)Description of Change:Implement Microchip Inner Labels and documentation changes for selected PSDS (Power Switching Discrete Solutions) Silicon Carbide (SiC) Products.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve productivity by standardizing the packing method as part of the integration of Microsemi and Microchip.Change Implementation Status:In ProgressEstimated First Ship Date:February 17, 2023 (date code: 2307)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MSC030SDA070BCT&field4=Microchip&field18=https://p1na.futureelectronics.com/de/p/semiconductors--discretes--diodes--silicon-carbide-diode-sic-diodes/msc030sda070bct-microchip-7148080
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MSC030SDA070BCT&field4=Microchip&field18=https://p1na.futureelectronics.com/de/p/semiconductors--discretes--diodes--silicon-carbide-diode-sic-diodes/msc030sda070bct-microchip-7148080
Microchip MSC030SDA070BCT - Technical Attributes
| Technology: | SiC (Silicon Carbide) Schottky |
| Reverse Voltage-Max: | 700V |
| Capacitance: | 128pF |
| Average Rectified Current-Max: | 60A |
| Forward Voltage: | 1.5V |
| Leakage Current: | 1µA |
| Operating Temp Range: | -55°C to +175°C |
| Product Status: | Active |
| Package Style: | TO-247-3 |
| Mounting Method: | Through Hole |
Available Packaging
Package Qty:
30 per Tube
Package Style:
TO-247-3
Mounting Method:
Through Hole