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Référence fabricant
AT24CM01-SSHD-B
AT24CM01 Series 1M (128K x 8) 5.5 V Surface Mount SPI Serial EEPROM - SOIC-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: |
Product Variant Information section
Emballages disponiblesQté d'emballage(s) :100 par Tube Style d'emballage :SOIC-8 Méthode de montage :Surface Mount |
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| Code de date: | 2402 | ||||||||||
Microchip AT24CM01-SSHD-B - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Product Category: MemoryDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 24AA1025, 24AA1026, 24AA128, 24AA256, 24AA32A, 24AA512, 24AA515, 24AA64, 24CS128, 24CS256, 24CS32, 24CS512, 24CS64, 24CSM01, 24CW1280, 24CW160, 24CW320, 24CW640, 24FC1025, 24FC1026, 24FC128, 24FC256, 24FC512, 24FC515, 24FC64, 24LC1025, 24LC1026, 24LC128, 24LC256, 24LC32A, 24LC512, 24LC515, 24LC64, 25AA1024, 25LC1024, AT24C512C, AT24CM01 and AT25M01 device families available in 8L SOIC (.150in) and 8L SOIJ (.208in) packages at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material at MTAI assembly site.Estimated First Ship Date: 15 April 2026 (date code: 2616)
Microchip has released a new Datasheet for the AT24CM01 - 1-Mbit I?C Serial EEPROM, Industrial Grade of devices. Description of Change:Updated date code format on Package Marking Information page; Updated title; Removed typical column in DC Characteristics table; Replaced terminology ?Master? and ?Slave? with ?Host? and ?Client?, respectively; Minor editorial updates throughout the document.Impacts to Data Sheet: See above details.Reason for Change: To Improve Productivity.Change Implementation Status: CompleteDate Document Changes Effective: 10 Oct 2024
Revision History:May 04, 2023: Issued initial notification.January 10, 2024: Issued final notification. Attached the Qualification Report. Updated the LF material, Paddle size and Die Attach material of MTAI in the Pre and Post Change Summary. Provided estimated first ship date to be on January 26, 2024.January 30, 2024: Re-issued final notification to update Pre and Post Change Summary.Description of Change:Qualification of MTAI as an additional assembly site for selected AT24C512C-SSHxx, AT24CM01-SSHxx and AT24CM02-SSHxx device families available in 8L SOIC (3.90mm(.150in)) package.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve productivity by qualifying MTAI as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:January 26, 2024 (date code: 2404)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
Revision History:\May 04, 2023: Issued initial notification.January 10, 2024: Issued final notification. Attached the Qualification Report. Updated the LF material, Paddle size and Die Attach material of MTAI in the Pre and Post Change Summary. Provided estimated first ship date to be on January 26, 2024.Description of Change:Qualification of MTAI as an additional assembly site for selected AT24C512C-SSHxx, AT24CM01-SSHxx and AT24CM02-SSHxx device families available in 8L SOIC (3.90mm(.150in)) package.additional assembly site for selected AT24C512C-SSHxx, AT24CM01-SSHxx and AT24CM02-SSHxx device families available in 8L SOIC (3.90mm(.150in)) package.
Revision History:October 18, 2023: Issued initial notification.November 07, 2023: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 15, 2023.December 4, 2023: Re-issued final notification to update and include the Package qual in the Qualification report.Description of Change:Qualification of United Microelectronics Corporation - Fab 8D (U08D) as new fabrication site for selected 24xx102x and AT24CM01 device families available in various packages.Reason for Change:To improve productivity and on-time delivery performance by qualifying United Microelectronics Corporation - Fab 8D (U08D) as a new fabrication site.
Description of Change:Qualification of MTAI as an additional assembly site for AT24CM01-SSHM-B, AT24CM01-SSHD-B, AT24CM01-SSHM-T and AT24CM01-SSHD-T catalog part numbers (CPN) available in 8L SOIC (3.90mm) package.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve on-time delivery performance by qualifying MTAI as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:December 15, 2023 (date code: 2350)Note: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: See attached
Revision History:October 18, 2023: Issued initial notification.November 07, 2022: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 15, 2023.Description of Change:Qualification of United Microelectronics Corporation - Fab 8D (U08D) as new fabrication site for selected 24xx102x and AT24CM01 device families available in various packages.Reason for Change:To improve productivity and on-time delivery performance by qualifying United Microelectronics Corporation - Fab 8D (U08D) as a new fabrication site.
PCN Status:Initial NotificationPCN Type:Manufacturing Change Description of Change:Qualification of United Microelectronics Corporation - Fab 8D (U08D) as new fabrication site for selected 24xx102x and AT24CM01 device families available in various packages.Pre and Post Change Summary: See attachedChange ImpactNoneReason for Change:To improve productivity and on-time delivery performance by qualifying United Microelectronics Corporation - Fab 8D (U08D) as a new fabrication site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2023Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Time Table Summary: See attached
Statut du produit:
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=AT24CM01-SSHD-B&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/de/p/semiconductors--memory--RAM--eeprom--i2c-interface-protocol/at24cm01-sshd-b-microchip-3107016
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=AT24CM01-SSHD-B&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/de/p/semiconductors--memory--RAM--eeprom--i2c-interface-protocol/at24cm01-sshd-b-microchip-3107016
Microchip AT24CM01-SSHD-B - Caractéristiques techniques
| Memory Density: | 1Mb |
| Memory Organization: | 128 K x 8 |
| Supply Voltage-Nom: | 2.5V to 5.5V |
| Clock Frequency-Max: | 1MHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Style d'emballage : | SOIC-8 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
100 par Tube
Style d'emballage :
SOIC-8
Méthode de montage :
Surface Mount