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Manufacturer Part #
BM70BLES1FC2-0B04AA
Bluetooth BLE Module, Shielded, Antenna, 12x22mm Industrial Temp
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:88 per Tray Mounting Method:Surface Mount | ||||||||||
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Microchip BM70BLES1FC2-0B04AA - Product Specification
Shipping Information:
ECCN:
PCN Information:
***FPCN109722 UPDATE***Revision History:December 17, 2024: Issued initial notification.January 24, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on February 24, 2025.Description of Change:Qualification of MTAI as an additional final test site for selected BM70, BM71, RN4870, RN4871 device families available in 16L (11.5x9x2.1 mm), 33L (12x22mm), 30L (12x15mm) and 17L (8x6x1.6 mm) Module packages.
Description of Change:Qualification of MTAI as an additional final test site for selected BM70, BM71,RN4870, RN4871 device families available in 16L (11.5x9x2.1 mm), 33L (12x22mm), 30L (12x15mm)and 17L (8x6x1.6 mm) Module packages.Reason for Change: To improve on-time delivery performance by qualifying MTAI as an additional finaltest site.V
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=BM70BLES1FC2-0B04AA&field4=Microchip&field18=https://p1na.futureelectronics.com/de/p/semiconductors--wireless-rf--rf-modules-solutions--proprietary/bm70bles1fc2-0b04aa-microchip-7106094
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=BM70BLES1FC2-0B04AA&field4=Microchip&field18=https://p1na.futureelectronics.com/de/p/semiconductors--wireless-rf--rf-modules-solutions--proprietary/bm70bles1fc2-0b04aa-microchip-7106094
Microchip BM70BLES1FC2-0B04AA - Technical Attributes
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
88 per Tray
Mounting Method:
Surface Mount