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Manufacturer Part #
ATMEGA8515-16AU
ATmega Series 8 KB Flash 512 B SRAM 16 MHz 8-Bit Microcontroller - TQFP-44
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:160 per Tray Package Style:TQFP-44 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2518 | ||||||||||
Microchip ATMEGA8515-16AU - Product Specification
Shipping Information:
ECCN:
PCN Information:
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
*** Update for PCN 113300 ***Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected AT42QT1481, AT42QT2640, AT89LP3240, AT89LP51, AT89LP51xxx, AT89LP52, AT89LP6440, AT89S8253, ATmega1284, ATmega1284P, ATmega16, ATmega16xx, ATmega32, ATmega32xx, ATmega644, ATMEGA644PA, ATmega85xx, ATxmega128xxx, ATxmega16xxxx, ATxmega32xxxx, ATxmega64xx, QT60326, QT6C1x, QT6C21 and QT6E22 device families available in 44L TQFP (10x10x1mm) package.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material. Estimated First Ship Date: 22 July 2025 (date code: 2530)Revision History: May 30, 2025: Issued final notification.June 03, 2025: Re-issued final notification to update lead-frame material.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected AT42QT1481, AT42QT2640, AT89LP3240, AT89LP51, AT89LP51xxx, AT89LP52, AT89LP6440, AT89S8253, ATmega1284, ATmega1284P, ATmega16, ATmega16xx, ATmega32, ATmega32xx, ATmega644, ATMEGA644PA, ATmega85xx, ATxmega128xxx, ATxmega16xxxx, ATxmega32xxxx, ATxmega64xx, QT60326, QT6C1x, QT6C21 and QT6E22 device families available in 44L TQFP (10x10x1mm) package.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated First Ship Date: 22 July 2025 (date code: 2530)
PCN Status:Final NotificationDescription of Change:Qualification of OSE as a new final test site for various products available in 32L TQFP (7x7x1mm), 44L TQFP (10x10x1mm), 64L TQFP (14x14x1mm) and 100L TQFP (14x14x1mm) packages.Reason for Change:To improve on-time delivery performance by qualifying OSE as a new final test site.Change Implementation Status:In ProgressEstimated First Ship Date:September 23, 2024 (date code: 2439)
Description of Change:Qualification of OSE as a new final test site for various products available in 32L TQFP (7x7x1mm), 44L TQFP (10x10x1mm), 64L TQFP (14x14x1mm) and 100L TQFP (14x14x1mm) packages.Reason for Change:To improve on-time delivery performance by qualifying OSE as a new final test site.
Part Status:
Microchip ATMEGA8515-16AU - Technical Attributes
| Family Name: | ATmega |
| Core Processor: | AVR |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 8kB |
| RAM Size: | 512B |
| Speed: | 16MHz |
| No of I/O Lines: | 35 |
| InterfaceType / Connectivity: | EBI/EMI/SPI/UART/USART |
| Peripherals: | Brown-out Detect/POR/PWM/Reset/Watchdog |
| Number Of Timers: | 2 |
| Supply Voltage: | 4.5V to 5.5V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 8-chx10-bit |
| Watchdog Timers: | 1 |
| Package Style: | TQFP-44 |
| Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
160 per Tray
Package Style:
TQFP-44
Mounting Method:
Surface Mount