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Manufacturer Part #
1542618-2
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800 per Tray
Surface Mount
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Product Description:Heat SinksGeneral Description of ChangesFollowing TE's on-going supply chain risk management strategy, the listed products are to be migrated to production sites from Zhuhai China plant to Dongguan China plant.Reason for Changes:Manufacturing location changeFirst Ship Date of Changed Items (Changed Parts Only):30-JAN-2026
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Tyco Electronics continues to be engaged in new pluggable interface standards to support the rapidly changing market needs for higher bandwidth, and remains and industry leader with the technical expertise required to deliver superior designs for signal integrity and EMI at higher data rates.
Applications for this product include any high density, high speed I/O application in Storage, Networking, Supercomputing, Telecom, switches, routers, servers, hubs, storage, controllers and Network Interface Cards (NICs).
XFP Series is a cage/connector/module system that features gasketing for excellent EMI containment, a riding heatsink for thermal dissipation, an intuitive latching system, and a 30 position SMT connector based on the SFP connector design. Tyco Electronics also offers copper cable assemblies that plug directly into an XFP port for lower cost short-reach applications.
Tyco Electronics led in the mechanical design within the XFP Multi-Source Agreement (MSA). The MSA specifies the mechanical and electrical requirements for the pluggable modules, cage hardware, thermal heat sinks and PCB connector. This technology converts serial electrical signals to external serial optical or electrical signals and is intended to be flexible enough to support OC192/STM-64, 10x Fibre Channel, G.709, and 10G Ethernet.
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.