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MCP2517FDT-H/SL
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2600 per Reel
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Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for MCP2517FD-H/SL, MCP2517FDT-H/SL, MCP2518FDT-E/SL and MCP2518FDT-H/SL catalog part numbers (CPN) available in 14L SOIC (.150in) packages at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material.Change Implementation Status: In ProgressEstimated First Ship Date: 26 May 2026 (date code: 2622)
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change:? Clarification of Register 3-3: CRC - CRC Register was added to Section ?Clarifications/Corrections to the Data Sheet?.? Added Section 7. Module: ?SPI Module?.? Added Section 8. Module: ?SPI/Device?.Please be advised that this is a change to the document only the product has not been changed.Reason for Change: To Improve Productivity
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Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
