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Manufacturer Part #
SST25VF080B-50-4I-QAE
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98 per Tube
Shipping Information:
COO is assigned at time of shipping and cannot be selected during the ordering process. All documents will indicate COO at time of shipping
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ECCN:
PCN Information:
Description of Change: Qualification of MMT as an additional assembly site for selected SST26WF016B, SST26WF016BA, SST26WF080B, SST26WF080BA, SST26WF040B, SST26WF040BA, SST26VF032B, SST26VF032BA, SST26WF064C, SST26VF064BEUI, SST26VF016B, SST26VF080A, SST26VF040A, SST26VF020A, SST25VF080B, SST25VF020B, SST25VF040B, SST26VF064B, SST26VF064BA and SST25PF020B device families available in 8L WSON (6x5x0.8mm) package.Reason for Change: To improve on-time delivery performance by qualifying MMT as an additional assembly site.Change Implementation Status: In ProgressEstimated Qualification Completion Date: January 2026
PCN Status:Final NotificationDescription of Change:Qualification of NSEB and UTL3 as additional assembly sites for selected SST25PF0xx, SST2xVF0xx, USBF1600x and USBF8100x device families available in 8L TDFN-S (6x5x0.8mm) package.Reason for Change:To improve on-time delivery performance by qualifying UTL3 and NSEB as an additional assembly sites.Change Implementation Status:In ProgressEstimated First Ship Date:May 31, 2024 (date code: 2422)
PCN Status:Final NotificationDescription of Change:Qualification of NSEB and UTL3 as additional assembly sites for the selected SST25VF016B, SST25VF040B, SST25VF080B, SST25WF020A and SST26VF016 device families available in 8L TDFN-S (6x5x0.8mm) package.mpacts to Data Sheet:Yes.Note: Microchip will issue separate PCN for datasheet update.Reason for Change:To improve on-time delivery performance by qualifying UTL3 and NSEB as an additional assembly sites.Change Implementation Status:In ProgressEstimated First Ship Date:May 31, 2024 (date code: 2422)
Description of Change:Qualification of NSEB and UTL3 as additional assembly sites for the selected SST26VF016, SST25VF016B, SST25VF0x0B and SST25WF020Ax device families available in 8L TDFN-S (6x5x0.8mm) package.Pre and Post Change Summary: See attachedImpacts to Data Sheet:Yes.Note: Microchip will issue separate PCN for datasheet update.Change ImpactNoneReason for Change:To improve on-time delivery performance by qualifying UTL3 and NSEB as an additional assembly sites.Change Implementation Status:In ProgressEstimated Qualification Completion Date:January 2024Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Time Table Summary: See attached
Description of Change: Qualification of NSEB and UTL3 as additional assembly sites for selected SST25PF0xx, SST2xVF0xx, USBF1600x and USBF8100x device families available in 8L TDFN-S (6x5x0.8mm) package.Reason for Change: To improve on-time delivery performance by qualifying UTL3 and NSEB as an additional assembly sites.
Description of Change: Corrected a typo on page 8.Reason for Change: To Improve ManufacturabilityNOTE: Please be advised that this is a change to the document only the product has not been changed.
Part Status:
Inventory held at our manufacturer's warehouse. Subject to availability and transit time.
