Référence fabricant
MCP6544-I/SL
QUAD 1.6V PUSH/PULL COMPARATOR, I TEMP
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :57 par Tube Style d'emballage :SOIC-14 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MCP6544-I/SL - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Microchip has released a new Datasheet for the MCP6541/1R/1U/2/3/4 Push-Pull Output Sub-Microamp Comparators Data Sheet of devices.Notification Status: FinalDescription of Change: Revision includes:1. Updated Section 5.1, Package Marking Information.2. Made minor formatting changes throughout the document.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 28 Oct 2022
Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 120K and 121K wafer technologies available in 14L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxy or Gold wire and 8390A die attach epoxy.Reason for Change: To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Statut du produit:
Microchip MCP6544-I/SL - Caractéristiques techniques
| Type: | General Purpose |
| No of Channels: | 4 |
| Average Bias Current-Max: | 1pA |
| Supply Voltage: | 1.6V to 5.5V |
| Thermal Resistance: | 95.3°C/W |
| Style d'emballage : | SOIC-14 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
57 par Tube
Style d'emballage :
SOIC-14
Méthode de montage :
Surface Mount