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Manufacturer Part #
MCP6544-I/SL
QUAD 1.6V PUSH/PULL COMPARATOR, I TEMP
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:57 per Tube Package Style:SOIC-14 Mounting Method:Surface Mount | ||||||||||
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Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change: The following is the list of modifications:1) Updated package drawings for the SC-70 package.Reason for Change: To Improve ProductivityDate Document Changes Effective: 13 Mar 2020NOTE: Please be advised that this is a change to the document only the product has not been changed.
Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 120K and 121K wafer technologies available in 14L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxy or Gold wire and 8390A die attach epoxy.Reason for Change: To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Technical Attributes
| Type: | General Purpose |
| No of Channels: | 4 |
| Average Bias Current-Max: | 1pA |
| Supply Voltage: | 1.6V to 5.5V |
| Thermal Resistance: | 95.3°C/W |
| Package Style: | SOIC-14 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
57 per Tube
Package Style:
SOIC-14
Mounting Method:
Surface Mount