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Référence fabricant
MIC5801YWM
MIC5801 Series 5 V 4.4 MHz Input 4-Bit Parallel-Input Latched Driver - SOIC-24W
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :31 par Tube Style d'emballage :SOIC-24W Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2348 | ||||||||||
Microchip MIC5801YWM - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: September 2025Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2 (TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
**FPCN97963 UPDATE**Revision History:May 10, 2023: Issued initial notification.June 21, 2024: Issued final notification. Attached the Qualification Report. Revised the Notification Subject to specify all affected device families. Provided estimated first ship date to be on July 19, 2024.Description of Change:Qualification of UNIG as an additional final test site for LM2574, LM2575, MIC2145, MIC2202, MIC2203, MIC2204, MIC2981, MIC4574, MIC4826, MIC4827, MIC4830, MIC4832, MIC4833, MIC5800, MIC5801, MIC5891, MIC58P01 and MIC59P50 device families available in Tube and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as an additional final test site.
Statut du produit:
Microchip MIC5801YWM - Caractéristiques techniques
| Style d'emballage : | SOIC-24W |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
31 par Tube
Style d'emballage :
SOIC-24W
Méthode de montage :
Surface Mount