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Référence fabricant
TC1262-3.3VDBTR
TC1262 Series 500 mA 3.3 V Fixed Output CMOS LDO Regulator - SOT-223
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: |
Product Variant Information section
Emballages disponiblesQté d'emballage(s) :4000 par Reel Style d'emballage :SOT-223 (TO-261-4, SC-73) Méthode de montage :Surface Mount |
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| Code de date: | 2330 | ||||||||||
Microchip TC1262-3.3VDBTR - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
*** Update for PCN 116914 ***Revision History: February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CTI/MCVAO. Issued initial notification.October 22, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on November 28, 2025. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Revised affected parts list.October 28, 2025: Revised affected parts list.November 3, 2025: Re-issued final notification to update affected parts list to add MCP9700T H/TTVAO-VW catalog part number. Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 28 November 2025 (date code: 2548)
*** Update for PCN 116870 ***Revision History: February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CT-I/MCVAO. Issued initial notification.October 22, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on November 28, 2025. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Revised affected parts list.October 28, 2025: Revised affected parts list.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 28 November 2025 (date code: 2548)
** *UPDATE OF PCN111024 & PCN113243***Revision History: February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CT I/MCVAO. Issued initial notification.October 22, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on November 28, 2025. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Revised affected parts list.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Estimated First Ship Date: 28 November 2025 (date code: 2548)
*** Update for PCN 111024 ***Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: October 2025Revision History:February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CTI/MCVAO.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file calledTempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: October 2025
PCN Status:Final NotificationDescription of Change:Qualification of HANA as an additional assembly site for selected MCP1703x, MCP182xx, TC1108, TC126x and TC2117 device families using 100x87 mils paddle size available in 3L SOT-223 package.Reason for Change:To improve on-time delivery performance by qualifying HANA as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:July 20, 2024 (date code: 2429)
Microchip has released a new Datasheet for the TC1262 Data Sheet of devices. If you are using one of these devices please read the document located at TC1262 Data Sheet.Notification Status: FinalDescription of Change: Revision D? Added automotive qualification to ?Features?.? Updated and added examples to ?Product Identification System?.? Updated ?Absolute Maximum Ratings?? to better describe the part.? Updated ?TC1262 Electrical Specifications?? Updated Section 6.0, Packaging Information.? Minor text and format changes throughout. Impacts to Data Sheet: See above detailsChange Implementation Status: CompleteDate Document Changes Effective: 10 Oct 2023NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Description of Change:Qualification of HANA as an additional assembly site for selected MCP1703x, MCP182xx, TC1108, TC126x and TC2117 device families using 100x87 mils paddle size available in 3L SOT-223 package.Reason for Change:To improve on-time delivery performance by qualifying HANA as an additional assembly site.
Statut du produit:
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Microchip TC1262-3.3VDBTR - Caractéristiques techniques
| Input Voltage-Min: | 2.7V |
| Input Voltage-Max: | 6V |
| Output Voltage Fixed: | 3.3V |
| Dropout Voltage-Max: | 650mV |
| Output Current-Max: | 500mA |
| Rated Power: | 1.69W |
| Tolerance (%): | ±0.5% |
| Operating Temp Range: | -40°C to +125°C |
| Regulator Topology: | Fixed |
| No. of Outputs: | Single |
| Output Noise: | 260V |
| Load Regulation (%): | 0.01% |
| Line Regulation (%): | 0.35% |
| Style d'emballage : | SOT-223 (TO-261-4, SC-73) |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The TC1262-3.3VDBTR is a Part of TC1262 Series 500 mA 3.3 V Fixed Output CMOS Low Dropout Regulator, Available in SOT-223-3-Pin Package.
The TC1262 is a fixed output, high accuracy (typically ±0.5%) CMOS low dropout regulator. Designed specifically for battery-operated systems, the TC1262’s CMOS construction eliminates wasted ground current, significantly extending battery life.
Features:
- Very Low Dropout Voltage
- 500 mA Output Current
- High Output Voltage Accuracy
- Standard or Custom Output Voltages
- Over Current and Over Temperature Protection
Applications:
- Battery Operated Systems
- Portable Computers
- Medical Instruments
- Instrumentation
- Cellular/GSM/PHS Phones
- Linear Post-Regulators for SMPS
- Pager
Emballages disponibles
Qté d'emballage(s) :
4000 par Reel
Style d'emballage :
SOT-223 (TO-261-4, SC-73)
Méthode de montage :
Surface Mount