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MCP19215-E/S8
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Product Category: 16-Bit Microcontrollers, 32-Bit Microcontrollers, 8-Bit Microcontrollers, Analog Multiplexer/Switch ICs, Analog to Digital Converters, CAN Controller, CAN Controller With Integrated Transceiver, Capacitive Touch Sensors, Current And Power Measurement Ics, Digital Signal Controllers, Digital to Analog Converters, Gate Drivers and Motor Drivers, Hybrid Controllers, Interface- Serial Peripherals, Power Management - PWM Controllers, SST Power Amplifiers, Ultrasound Transmitter Pulser ICs, Wireless Modules, Wireless Power And USB-PD ControllerNotification Subject: CCB 8425 Initial Notice: Qualification of 558-2C31 as a new die attach material for selected various device families available in various packages at NSEB (UTL-1) assembly site.Description of Change: Qualification of 558-2C31 as a new die attach material for selected various device families available in various packages at NSEB (UTL-1) assembly site.Pre and Post Summary Changes: See attached SPCN documentReason for Change: To improved manufacturability by qualifying 558-2C31 as a new die attach material at NSEB (UTL-1) site.Estimated Qualification Completion Date: November 2026
Product Category: Hybrid ControllersNotification Subject: MCP19214/15 Silicon Errata and Data Sheet ClarificationDescription of Change:Initial release of this documentReason for Change: To Improve ProductivityDate Document Changes Effective: 11 Jun 2026
***UPDATE OF PCN111555, PCN120669***Revision History: March 19, 2025: Issued initial notification.April 17, 2026: Issued final notification. Provided the estimated first ship date to be on April 24, 2026. Updated the Notification Subject and Description of Change to add missing device families and also updated the Qualification Plan title and purpose.April 22, 2026: Re-issued final notification to remove the word Qualification Report in the revision history.Product Category: Hybrid Controllers, Power Management - PWM Controllers, Switching RegulatorsDescription of Change: Qualification of Microchip Technology Gresham – Fab 4 (GRTM) as a new fabrication location for the selected MCP1661, MCP1662, MCP1663, MCP1664, MCP19035, MCP19110, MCP19111, MCP19114, MCP19115, MCP19116, MCP19117, MCP19118, MCP19119, MCP19122, MCP19123, MCP19124, MCP19125, MCP19214 and MCP19215 device families of 165K technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Estimated First Ship Date: 24 April 2026 (date code: 2617)
*** Update of FPCN 111555 / Multiple Change Notification ***Revision History: March 19, 2025: Issued initial notification.April 17, 2026: Issued final notification. Attached the Qualification Report. Provided the estimated first ship date to be on April 24, 2026. Updated the Notification Subject and Description of Change to add missing device families and also updated the Qualification Plan title and purpose.Description of Change: Qualification of Microchip Technology Gresham – Fab 4 (GRTM) as a new fabrication location for the selected MCP1661, MCP1662, MCP1663, MCP1664, MCP19035, MCP19110, MCP19111, MCP19114, MCP19115, MCP19116, MCP19117, MCP19118, MCP19119, MCP19122, MCP19123, MCP19124, MCP19125, MCP19214 and MCP19215 device families of 165K technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe – Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: 05 June 2026Estimated First Ship Date: 24 April 2026 (date code: 2617)
Description of Change: Qualification of MTAI as an additional assembly site for selected MCP19215 device family available in 32L QFN (5x5x0.9mm) package.Reason for Change: To improve on-time delivery performance by qualifying MTAI as an additional assembly site.Estimated Qualification Completion Date: September 2025
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for the selected MCP1661, MCP1662, MCP1663, MCP19110, MCP19116,MCP19117, MCP19122, MCP19123, MCP19124 and MCP19214 device families of 165K technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
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