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Référence fabricant
MIC2250YML-TR
MIC2250 Series 5.5 V 2.5 MHz High-Efficiency Low EMI Boost Regulator - MLF-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :5000 par Reel Style d'emballage :MLF-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MIC2250YML-TR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 113339 ***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)Revision History:November 22, 2023: Issued initial notification.October 31, 2024: Re-issued initial notification. Updated the qualification plan to include High Temperature Storage Life (HTSL) test. Updated the affected CPN list to remove the EOL'd CPNs. Updated the estimated qualification completion date and the timetable summary from June 2024 to October 2024.May 30, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on June 30, 2025. Updated affected CPN list based on the updated scope to remove selected 93LCxx, 93AAxx, 93C4xx, MCP6xx, 93C8xx, 93C7xx, 24C0xx, MCP1xx, 93C6xx, 24FCxx, SY88xx, PIC1xx, MIC5xx, SY58xx, SY89xx, 93C5xx, 24LCxx, 24AAxx, 34AAxx, 25LCxx, 25AAxx, SPN1xx and MICRxx device families and to add selected MIC46xx, SM802xx, SM803xx, MIC52xx, MIC53xx, MIC82xx, MIC27xx, MIC26xx, MIC84xx, MIC20xx, MIC94xx, MIC22xx, MIC23xx, MIC28xx, MIC44xx, PIC12xx, PIC16xx, PIC18xx and dsPIC33FJ32MC202 device families.September 18, 2025: Re-issued final notification to update the Qualification Report to include wire bond pull, wire bond shear and solderability test results. Updated affected CPN list to remove EOL'd CPNs.
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected 161-699102, MAQ3203, MIC21xx, MIC22xx, MIC25xx, MIC32xx,MIC422x, MIC44Fxx, MIC682xx, MIC68400, MIC68401, MIC691xx, MIC6930, MIC69502, MIC79110 and MIC920 device families of 2AK (BCD12) technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Revision History:May 29, 2023: Issued initial notification.May 24, 2024: Issued final notification. Attached the Qualification Report. Revised the affected parts list due to updated scope. Provided estimated first ship date to be on June 14, 2024.Description of Change:Qualification of UNIG as a new final test site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MIC2250YML-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--regulators-reference--switching-regulators/mic2250yml-tr-microchip-9779430
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MIC2250YML-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--regulators-reference--switching-regulators/mic2250yml-tr-microchip-9779430
Microchip MIC2250YML-TR - Caractéristiques techniques
| Topology: | Boost |
| Input Voltage: | 2.5V to 5.5V |
| Output Current-Max: | 2A |
| Switching Frequency-Max: | 2.5MHz |
| Style d'emballage : | MLF-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MIC2250YMLTR is a general purpose DC/DC boost switching regulator that features low noise, EMI reduction circuitry, and high efficiency across a wide output current range.
The MIC2250 is optimized for noise-sensitive hand held battery powered applications. A proprietary control method allows low ripple across the output voltage and current ranges. The MIC2250 incorporates a pseudo-random dithering function to reduce EMI levels up to 10 dB enabled by the DITH pin.
Features:
- Over 80% efficient for a 300:1 load range
- 2.5 V to 5.5 V input voltage range
- Output voltage adjustable to 32 V
- 2 A switch current
- Constant peak current control reduces output ripple
- EMI reduction circuitry
- Stable with small ceramic capacitors
- <1 µA shutdown current
- UVLO and thermal shutdown
- 8-pin 2 mm x 2 mm leadless MLF® package
- –40° to +125°C junction temperature range
Applications:
- LCD/OLED display bias supply
- CCD bias supply
- Mobile Phones,PDA,Media players, GPS PND
- Haptic displays
- Local 5 v, 15 v, 24 v rail
Emballages disponibles
Qté d'emballage(s) :
5000 par Reel
Style d'emballage :
MLF-8
Méthode de montage :
Surface Mount
