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Référence fabricant
IXGH10N170
IXGH Series 1700 Vce 10 A 30 ns t(on) High Voltage IGBT - TO-247AD
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| Nom du fabricant: | Littelfuse - IXYS | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :30 par Tube Style d'emballage :TO-247-3 Méthode de montage :Through Hole | ||||||||||
| Code de date: | |||||||||||
Littelfuse - IXYS IXGH10N170 - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description:This letter serves as a notification to inform you that we are improving our packing methodology to eliminate the risk of product contamination by implementing a vacuum-sealed shielded bag. This improvement applies to power discrete parts that are currently packed in Tube only.Effective date : Jan 2, 2026
Description:This letter serves as a notification to inform you that we are improving our packing methodology to eliminate the risk of product contamination by implementing a vacuum-sealed shielded bag. This improvement applies to power discrete parts that are currently packed in Tube only.Form, fit, function changes : No changeEffective date : Jan 2, 2026
*****FPCN105537 UPDATE/MULITIPLE CHANGE****Description of Change:This PCN is a revised version of the previously issued PCN LFPCN-DMI-BTA-2024-001/01, dated May 13, 2024, which informed you of an additional backend manufacturing site for the discrete MOSFET and IGBT parts. This updated version includes change in lead finish.1. Addition of in-house assembly line in Lipa as a new supplier and alternative source for TO-247-3L, TO-247HV, PLUS247, PLUS TO-247HV (PLUS247HV), ISO247 and ISOPLUS247 packages. This will further streamline and enhance our supply chain efficiencies.2. Change in device marking3. Change in inner box and tube labels, and tube dimensions: 4. Change in lead finish*New country of origin: Philippines
Littelfuse would like to notify you of an addition in the backend manufacturing of the discrete MOSFET & IGBT parts listed under appendix C.DESCRIPTION OF CHANGE:1. Addition of in-house assembly line in Lipa as a new supplier and alternative source for TO-247-3L, TO-247HV, PLUS247, PLUS TO-247HV (PLUS247HV), ISO247 and ISOPLUS247 packages. This will further streamline and enhance our supply chain efficiencies.2. Change in device marking: Details under APPENDIX A.3. Change in inner box and tube labels, and tube dimensions: Details under APPENDIX A.
DESCRIPTION OF CHANGE: As a part of Littelfuse endeavors to improve the manufacturing footprint and to enhance capacity, it has been decided to introduce a new TO-247 backend manufacturing ATXWH in China. The change is affecting the parts listed in appendix B. The country of origin for TO247 will possibly be Korea, Philippines, and China
DESCRIPTION OF CHANGE: As a part of Littelfuse endeavors to improve the manufacturing footprint and to enhance capacity, it has been decided to introduce a new TO-247 backend manufacturing ATXWH in China. The change is affecting the parts listed in appendix B. The country of origin for TO247 will possibly be Korea, Philippines, and China
SUBJECT: Assembled Device Marking Format Changes and Outer Box/Bag Label Format Changes - Change to the assembled device marking format The change affects the date code and tracking number identification. This change does not affect the form, fit or function of the product. See attached for more details - Change to the box label format: The paper sticker label found on the outer box or bag will see a format change that incorporates the Littelfuse logo along with the IXYS logo. The printed information remains the same (PN, Qty, Lot #, date code, country of origin). The change allows for a improved readability. This change does not affect the form, fit or function of the product. REMARKS: This changes from the original IXYS Corporation marking/labeling format to the new IXYS LLC-USA format is being done to conform to the SAP product management system requirements of our parent company Littelfuse Corporation.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=IXGH10N170&field4=Littelfuse - IXYS&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--discretes--transistors--igbts/ixgh10n170-littelfuse-ixys-4569240
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- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=IXGH10N170&field4=Littelfuse - IXYS&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--discretes--transistors--igbts/ixgh10n170-littelfuse-ixys-4569240
Littelfuse - IXYS IXGH10N170 - Caractéristiques techniques
| CE Voltage-Max: | 1700V |
| Collector Current @ 25C: | 20A |
| Power Dissipation-Tot: | 110W |
| Turn-on Delay Time: | 30ns |
| Turn-off Delay Time: | 132ns |
| Style d'emballage : | TO-247-3 |
| Méthode de montage : | Through Hole |
Emballages disponibles
Qté d'emballage(s) :
30 par Tube
Style d'emballage :
TO-247-3
Méthode de montage :
Through Hole