Pays de livraison
Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
Pays sélectionné
Référence fabricant
SST26VF064B-104I/SM
Tèlèchargez les modèles CAD pour ce produit. En savoir plus sur SnapMagic.
90 par Tube
SOIJ-8
Surface Mount
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for selected SST25PF020B, SST25VF020B, SST25VF040B, SST25VF080B, SST26VF016B, SST26VF016BEUI, SST26VF020A, SST26VF032B, SST26VF032BA, SST26VF032BEUI, SST26VF040A, SST26VF064B, SST26VF064BA, SST26VF064BEUI, SST26VF080A and USBF8100 device families available in 8L SOIJ (.208in) package at MTAI assembly site.Reason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material. Estimated First Ship Date: 12 June 2026 (date code: 2624)
*** Update of FPCN 119261 ***Revision History:February 23, 2026: Issued initial notification.February 26, 2026: Re-issued initial notification to include SOIJ package in the Notification subject.Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for selected SST26VF016B, SST26VF016BEUI, SST26VF032B, SST26VF032BA, SST26VF032BEUI, SST25VF080B, SST25VF040B, SST26WF064C, SST26VF064B, SST26VF064BA, SST26VF064BEUI, SST25VF020B, SST25PF020B, SST26VF080A, SST26VF040A, SST26VF020A, USBF8100, SST26WF080B, SST26WF080BA, SST26WF040B, SST26WF040BA, SST26WF016B and SST26WF016BA device families available in 8L SOIC and SOIJ (.208in and .150in) packages at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material.Estimated Qualification Completion Date: April 2026
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for selected SST26VF016B, SST26VF016BEUI, SST26VF032B, SST26VF032BA, SST26VF032BEUI, SST25VF080B, SST25VF040B, SST26WF064C, SST26VF064B, SST26VF064BA, SST26VF064BEUI, SST25VF020B, SST25PF020B, SST26VF080A, SST26VF040A, SST26VF020A, USBF8100, SST26WF080B, SST26WF080BA, SST26WF040B, SST26WF040BA, SST26WF016B and SST26WF016BA device families available in 8L SOIC (.208in and .150in) packages at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach materialEstimated Qualification Completion Date: April 2026
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Data Sheet - SST26VF064B / SST26VF064BA, 3.0V 64 Mbit Serial Quad I/O (SQI) Flash Memory Data Sheet Document Revision Description of Change: 1) Revised "Product Description" on page 1. 2) Added footnote to Table 7-4 on page 47. 3) Added information for "MN" package 8-WDFN. 4) Added Part Markings. 5) Updated Package definitions for "Product Identification System" on page 65. NOTE: Please be advised that this is a change to the document only the product has not been changed
Statut du produit:
Sur commande
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
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