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Référence fabricant
ATSAMD21G16B-MU
MCU 32-bit SAM D21 ARM Cortex M0+ RISC 64KB Flash 3.3V 48-Pin QFN EP T/R
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :416 par Tray Style d'emballage :QFN-48 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip ATSAMD21G16B-MU - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 113133 ***Revision History: May 16, 2025: Issued initial notification.October 12, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date is to be on October 31, 2025. Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected ATSAMC20G15A, ATSAMC20G16A, ATSAMC20G17A, ATSAMC20G18A, ATSAMC21G15A, ATSAMC21G16A, ATSAMC21G17A, ATSAMC21G18A, ATSAMD20G14, ATSAMD20G15, ATSAMD20G16, ATSAMD20G17, ATSAMD20G18, ATSAMD21G15, ATSAMD21G16x, ATSAMD21G17x, ATSAMD21G18, ATSAML21G16B, ATSAML21G17B and ATSAML21G18B device families available in 48L VQFN (7x7x0.9mm) package at MP3A assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated First Ship Date: 31 October 2025 (date code: 2544)
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
****FPCN115312/FPCN114582 UPDATE/MATERIAL CHANGE*****Description of Change: Qualification of palladium-coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATSAMD21xx, ATSAMC21xx, ATSAMC20xx, ATSAMDA1xx, ATSAMD20xx, ATSAML22xx, ATSAML21xx, PIC32CM2xx, PIC32CM1xx, PIC32CM3xx, PIC32CM6xx, ATSAML10xx,ATSAML11xx and PIC32CM5xx device families available in 32L and 48L VQFN (5x5x1mm and 7x7x0.9mm) packages at MMT assembly site.Reason for Change: To improve manufacturability by qualifying palladium-coated copper with gold flash (CuPdAu) bond wire as an additional wire material.Estimated First Ship Date: 14 November 2025 (date code: 2546)
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected ATSAMC20G15A, ATSAMC20G16A, ATSAMC20G17A, ATSAMC20G18A, ATSAMC21G15A, ATSAMC21G16A, ATSAMC21G17A, ATSAMC21G18A, ATSAMD20G14, ATSAMD20G15, ATSAMD20G16, ATSAMD20G17, ATSAMD20G18, ATSAMD21G15, ATSAMD21G16x, ATSAMD21G17x, ATSAMD21G18, ATSAML21G16B, ATSAML21G17B and ATSAML21G18B device families available in 48L VQFN (7x7x0.9mm) package at MP3A assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated Qualification Completion Date: June 2025
Description of Change:The following updates were performed in this revision:? Updated the document throughout to reflect new silicon revisions H, I, and J? Removed obsolete Data Sheet Clarifications? Added errata Device: 1.5.9 One-Time Programmable LockPlease be advised that this is a change to the document only the product has not been changed.Reason for Change: To Improve Productivity
PCN Status:Final NotificationDescription of Change:Qualification of MP3A as an additional assembly site for ATSAMD21G1xx, ATSAMC21G1xx, ATSAMD20G1xx, ATSAML21G1xx, ATSAML22G1xx, ATSAMC20G1xx device families available in 48L VQFN (7x7x0.9mm) package.Reason for Change:To improve productivity by qualifying MP3A as an additional assembly site.
PCN Status:Initial NotificationDescription of Change:Qualification of MP3A as an additional assembly site for ATSAMD21G1xx, ATSAMC21G1xx, ATSAMD20G1xx, ATSAML21G1xx, ATSAML22G1xx, ATSAMC20G1xx device families available in 48L VQFN (7x7x0.9mm) package.Reason for Change:To improve productivity by qualifying MP3A as an additional assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:July 2023
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=ATSAMD21G16B-MU&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--microcontrollers--32-bit/atsamd21g16b-mu-microchip-5114055
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=ATSAMD21G16B-MU&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--microcontrollers--32-bit/atsamd21g16b-mu-microchip-5114055
Microchip ATSAMD21G16B-MU - Caractéristiques techniques
| Family Name: | SAMD21G |
| Core Processor: | ARM Cortex M0+ |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 64kB |
| RAM Size: | 8kB |
| Speed: | 48MHz |
| No of I/O Lines: | 38 |
| InterfaceType / Connectivity: | I2C/LINbus/SPI/UART/USART |
| Peripherals: | Brown-out Detect/DMA/I2S/POR/PWM/Reset/Watchdog |
| Supply Voltage: | 1.62V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 14-chx12-bit |
| On-Chip DAC: | 1-chx10-bit |
| Style d'emballage : | QFN-48 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
416 par Tray
Style d'emballage :
QFN-48
Méthode de montage :
Surface Mount