
Manufacturer Part #
PIC18F26K40T-I/SS
PIC16F Series 64 KB Flash 3.6 KB SRAM 64 MHz 8-Bit Microcontroller - SSOP-28
Microchip PIC18F26K40T-I/SS - Product Specification
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Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 3280 as a new die attach material for selected PIC16F18xx, PIC18F24xx, PIC18F25xx, PIC18F26xx, PIC16F15xx, PIC18F27xx, AVR64DU2xx, AVR32DA2xx, AVR64DD2xx, AVR32DD2xx, AVR16DD2xx, PIC16F19xx, AVR128DBxx, AVR64DB2xx, AVR32DB2xx, AVR128DAxx, AVR64DA2xx, AVR32DU2xx and AVR16DU2xx device families available in 28L SSOP (.209in) at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 3280 as a new die attach material.
Microchip has released a new Datasheet for the PIC18(L)F26/45/46K40 28/40/44-Pin, Low-Power, High-Performance Microcontrollers with XLP Technology Data Sheet of devices. Notification Status: FinalDescription of Change:Updated reset values for IPR0, IPR3, TMR0H and BAUDxCON.Added data sheet clarifications.Other minor editorial corrections.Impacts to Data Sheet: See above details.Reason for Change: To Improve Productivity.Change Implementation Status: CompleteDate Document Changes Effective: 10 Oct 2024
Microchip has released a new Document for the PIC18(L)F26/45/46K40 Family Silicon Errata and Data Sheet Clarification of devices. Notification Status: FinalDescription of Change:Updated document format to most current version; silicon issues are renumbered accordingly.Added silicon issue 1.7.2 (TMR0H Register Does Not Increment).Updated data sheet revision level and removed existing data sheet clarifications.Other minor editorial corrections.Impacts to Data Sheet: None.Reason for Change: To Improve Productivity.Change Implementation Status: CompleteDate Document Changes Effective: 10 Oct 2024
Microchip has released a new Errata for the PIC18(L)F26/45/46K40 Family Silicon Errata and Data Sheet Clarification of devices. If you are using one of these devices please read the document located at PIC18(L)F26/45/46K40 Family Silicon Errata and Data Sheet Clarification.Notification Status: FinalDescription of Change: Update PFM back-to-back workaround. Move software breakpoints to PIC18 Debug Executive.Impacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 07 Oct 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices::N/A
Microchip has released a new Product Documents for the PIC18(L)F26/45/46/55/56K42 Silicon Errata and Data Sheet Clarification of devicesNotification Status: FinalDescription of Change: - Added Module 9.4 Double Sample Conversions, 13 Central Processing Unit (CPU), and 13.1 FSR Shadow Registers.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 11 May 2022
Part Status:
Microchip PIC18F26K40T-I/SS - Technical Attributes
Family Name: | PIC18F |
Core Processor: | PIC |
Program Memory Type: | Flash |
Flash Size (Bytes): | 64kB |
RAM Size: | 3.6kB |
Speed: | 64MHz |
No of I/O Lines: | 25 |
InterfaceType / Connectivity: | I2C/LINbus/SPI/UART/USART |
Peripherals: | Brown-out Detect/LVD/POR/PWM/Reset/Watchdog |
Supply Voltage: | 2.3V to 5.5V |
Operating Temperature: | -40°C to +85°C |
On-Chip ADC: | 24-chx10-bit |
On-Chip DAC: | 1-chx5-bit |
Watchdog Timers: | 1 |
Package Style: | SSOP-28 |
Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
2100 per Reel
Package Style:
SSOP-28
Mounting Method:
Surface Mount